Low temperature bonding using sub-micron Au particles for wafer-level MEMS packaging

Shin Ito, Jun Mizuno, Hiroyuki Ishida, Toshinori Ogashiwa, Yukio Kanehira, Hiroshi Murai, Fumihiro Wakai, Shuichi Shoji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

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Engineering & Materials Science