Abstract
We propose a low temperature bonding technique using an ultrathin intermediate layer deposited by atomic layer deposition. The ultrathin Pt film is selectively deposited on Cu surfaces without any masks. In order to reduce a deterioration of a reliability caused by impurities in the bonding interface, quasi-direct bonding was realized by thinning Pt intermediate layer. The shear strength of Cu-Cu bonding with the Pt intermediate layer achieved 9.5 MPa, which was five times higher than that without the Pt intermediate layer. We expect that the proposed bonding technique has a high potential to low temperature packaging technologies.
| Original language | English |
|---|---|
| Title of host publication | 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 |
| Publisher | IEEE Computer Society |
| Pages | 123-126 |
| Number of pages | 4 |
| ISBN (Electronic) | 9781538656150 |
| DOIs | |
| Publication status | Published - 2019 Jan 24 |
| Event | 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 - Taipei, Taiwan, Province of China Duration: 2018 Oct 24 → 2018 Oct 26 |
Publication series
| Name | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT |
|---|---|
| Volume | 2018-October |
| ISSN (Print) | 2150-5934 |
| ISSN (Electronic) | 2150-5942 |
Conference
| Conference | 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 |
|---|---|
| Country | Taiwan, Province of China |
| City | Taipei |
| Period | 18/10/24 → 18/10/26 |
Fingerprint
ASJC Scopus subject areas
- Hardware and Architecture
- Control and Systems Engineering
- Electrical and Electronic Engineering
Cite this
Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition. / Yamada, Kosuke; Kuwae, Hiroyuki; Kamibayashi, Takumi; Momose, Wataru; Shoji, Shuichi; Mizuno, Jun.
13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, 2019. p. 123-126 8625756 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; Vol. 2018-October).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition
AU - Yamada, Kosuke
AU - Kuwae, Hiroyuki
AU - Kamibayashi, Takumi
AU - Momose, Wataru
AU - Shoji, Shuichi
AU - Mizuno, Jun
PY - 2019/1/24
Y1 - 2019/1/24
N2 - We propose a low temperature bonding technique using an ultrathin intermediate layer deposited by atomic layer deposition. The ultrathin Pt film is selectively deposited on Cu surfaces without any masks. In order to reduce a deterioration of a reliability caused by impurities in the bonding interface, quasi-direct bonding was realized by thinning Pt intermediate layer. The shear strength of Cu-Cu bonding with the Pt intermediate layer achieved 9.5 MPa, which was five times higher than that without the Pt intermediate layer. We expect that the proposed bonding technique has a high potential to low temperature packaging technologies.
AB - We propose a low temperature bonding technique using an ultrathin intermediate layer deposited by atomic layer deposition. The ultrathin Pt film is selectively deposited on Cu surfaces without any masks. In order to reduce a deterioration of a reliability caused by impurities in the bonding interface, quasi-direct bonding was realized by thinning Pt intermediate layer. The shear strength of Cu-Cu bonding with the Pt intermediate layer achieved 9.5 MPa, which was five times higher than that without the Pt intermediate layer. We expect that the proposed bonding technique has a high potential to low temperature packaging technologies.
UR - http://www.scopus.com/inward/record.url?scp=85062452713&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85062452713&partnerID=8YFLogxK
U2 - 10.1109/IMPACT.2018.8625756
DO - 10.1109/IMPACT.2018.8625756
M3 - Conference contribution
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 123
EP - 126
BT - 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
PB - IEEE Computer Society
ER -