Low temperature Cu bonding with large tolerance of surface oxidation

Hui Ren, Fengwen Mu, Seongbin Shin, Lei Liu, Guisheng Zou, Tadatomo Suga

Research output: Contribution to journalArticle

Abstract

A novel method of low temperature all-Cu bonding was developed, which has a large tolerance for Cu surface oxidation and can even bond Cu with a thick oxide layer at 250 °C. It is significant for the chip level bonding because traditional methods have strict requirements for surface quality. The key process is to combine Cu nanoparticle paste and Pt-catalyzed formic acid vapor, which improved the bonding strength of oxidized-Cu by ∼78.5% and is expected to simplify the bonding process. To understand the mechanisms, interfacial analyses of the microstructure and composition were carried out, along with a surface analysis.

Original languageEnglish
Article number055127
JournalAIP Advances
Volume9
Issue number5
DOIs
Publication statusPublished - 2019 May 1
Externally publishedYes

Fingerprint

oxidation
formic acid
chips
vapors
nanoparticles
requirements
microstructure
oxides

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Low temperature Cu bonding with large tolerance of surface oxidation. / Ren, Hui; Mu, Fengwen; Shin, Seongbin; Liu, Lei; Zou, Guisheng; Suga, Tadatomo.

In: AIP Advances, Vol. 9, No. 5, 055127, 01.05.2019.

Research output: Contribution to journalArticle

Ren, Hui ; Mu, Fengwen ; Shin, Seongbin ; Liu, Lei ; Zou, Guisheng ; Suga, Tadatomo. / Low temperature Cu bonding with large tolerance of surface oxidation. In: AIP Advances. 2019 ; Vol. 9, No. 5.
@article{3f20b3e2e98641d89b2e92143a88f6d3,
title = "Low temperature Cu bonding with large tolerance of surface oxidation",
abstract = "A novel method of low temperature all-Cu bonding was developed, which has a large tolerance for Cu surface oxidation and can even bond Cu with a thick oxide layer at 250 °C. It is significant for the chip level bonding because traditional methods have strict requirements for surface quality. The key process is to combine Cu nanoparticle paste and Pt-catalyzed formic acid vapor, which improved the bonding strength of oxidized-Cu by ∼78.5{\%} and is expected to simplify the bonding process. To understand the mechanisms, interfacial analyses of the microstructure and composition were carried out, along with a surface analysis.",
author = "Hui Ren and Fengwen Mu and Seongbin Shin and Lei Liu and Guisheng Zou and Tadatomo Suga",
year = "2019",
month = "5",
day = "1",
doi = "10.1063/1.5097382",
language = "English",
volume = "9",
journal = "AIP Advances",
issn = "2158-3226",
publisher = "American Institute of Physics Publising LLC",
number = "5",

}

TY - JOUR

T1 - Low temperature Cu bonding with large tolerance of surface oxidation

AU - Ren, Hui

AU - Mu, Fengwen

AU - Shin, Seongbin

AU - Liu, Lei

AU - Zou, Guisheng

AU - Suga, Tadatomo

PY - 2019/5/1

Y1 - 2019/5/1

N2 - A novel method of low temperature all-Cu bonding was developed, which has a large tolerance for Cu surface oxidation and can even bond Cu with a thick oxide layer at 250 °C. It is significant for the chip level bonding because traditional methods have strict requirements for surface quality. The key process is to combine Cu nanoparticle paste and Pt-catalyzed formic acid vapor, which improved the bonding strength of oxidized-Cu by ∼78.5% and is expected to simplify the bonding process. To understand the mechanisms, interfacial analyses of the microstructure and composition were carried out, along with a surface analysis.

AB - A novel method of low temperature all-Cu bonding was developed, which has a large tolerance for Cu surface oxidation and can even bond Cu with a thick oxide layer at 250 °C. It is significant for the chip level bonding because traditional methods have strict requirements for surface quality. The key process is to combine Cu nanoparticle paste and Pt-catalyzed formic acid vapor, which improved the bonding strength of oxidized-Cu by ∼78.5% and is expected to simplify the bonding process. To understand the mechanisms, interfacial analyses of the microstructure and composition were carried out, along with a surface analysis.

UR - http://www.scopus.com/inward/record.url?scp=85066798789&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85066798789&partnerID=8YFLogxK

U2 - 10.1063/1.5097382

DO - 10.1063/1.5097382

M3 - Article

VL - 9

JO - AIP Advances

JF - AIP Advances

SN - 2158-3226

IS - 5

M1 - 055127

ER -