Low temperature Cu–Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn–Bi eutectic powders

    Research output: Contribution to journalArticle

    3 Citations (Scopus)

    Abstract

    Fluxless bonding of plateless Cu–Cu substrates at processing temperature lower than 250 °C and low pressure of 0.1 MPa was achieved by transient liquid phase sintering (TLPS) of mixed Cu nanoparticles and Sn–Bi eutectic powders. The effects of mixture composition, and sintering temperature on the shear strength, microstructure, and remelting temperature were investigated. Lowering the sintering temperature of Cu mixed with 65 weight percentage of Sn–Bi (Cu–65SnBi) resulted in decreased shear strength, however, at 200 °C sintering temperature, the obtained highest shear strength was more than 20 MPa. It was found that it is essential to use Cu nanoparticles to accelerate the consumption so that no initial Sn–Bi phases remained after processing. The liquid phase generated at approximately 196 °C during sintering from the reaction between newly formed Cu6Sn5 and Bi-phase was expected to facilitate the densification and strengthening of the joints. Although this newly generated liquid phase was known to solidify as hypereutectic Sn–Bi, by controlling the sintering temperature at 200 °C, the remelting event at 139 °C was not observed by differential scanning calorimetry. It is assumed that the proportion of solidified Sn–Bi eutectic phases in Cu–65SnBi that was sintered at 200 °C were significantly small, hence, when reheated at 150 °C, the obtained shear strength was equivalent to that at room temperature.

    Original languageEnglish
    Pages (from-to)16433-16443
    Number of pages11
    JournalJournal of Materials Science: Materials in Electronics
    Volume28
    Issue number21
    DOIs
    Publication statusPublished - 2017 Nov 1

    Fingerprint

    liquid phase sintering
    Liquid phase sintering
    eutectics
    Powders
    Nanoparticles
    Eutectics
    shear strength
    sintering
    Shear Strength
    nanoparticles
    Temperature
    Sintering
    Shear strength
    Remelting
    liquid phases
    temperature
    melting
    densification
    proportion
    Differential Scanning Calorimetry

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Atomic and Molecular Physics, and Optics
    • Condensed Matter Physics
    • Electrical and Electronic Engineering

    Cite this

    @article{cd1605bc545c4e67854e3847e92bc010,
    title = "Low temperature Cu–Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn–Bi eutectic powders",
    abstract = "Fluxless bonding of plateless Cu–Cu substrates at processing temperature lower than 250 °C and low pressure of 0.1 MPa was achieved by transient liquid phase sintering (TLPS) of mixed Cu nanoparticles and Sn–Bi eutectic powders. The effects of mixture composition, and sintering temperature on the shear strength, microstructure, and remelting temperature were investigated. Lowering the sintering temperature of Cu mixed with 65 weight percentage of Sn–Bi (Cu–65SnBi) resulted in decreased shear strength, however, at 200 °C sintering temperature, the obtained highest shear strength was more than 20 MPa. It was found that it is essential to use Cu nanoparticles to accelerate the consumption so that no initial Sn–Bi phases remained after processing. The liquid phase generated at approximately 196 °C during sintering from the reaction between newly formed Cu6Sn5 and Bi-phase was expected to facilitate the densification and strengthening of the joints. Although this newly generated liquid phase was known to solidify as hypereutectic Sn–Bi, by controlling the sintering temperature at 200 °C, the remelting event at 139 °C was not observed by differential scanning calorimetry. It is assumed that the proportion of solidified Sn–Bi eutectic phases in Cu–65SnBi that was sintered at 200 °C were significantly small, hence, when reheated at 150 °C, the obtained shear strength was equivalent to that at room temperature.",
    author = "Muhammad, {Khairi Faiz} and Kazuma Bansho and Tadatomo Suga and Tomoyuki Miyashita and Makoto Yoshida",
    year = "2017",
    month = "11",
    day = "1",
    doi = "10.1007/s10854-017-7554-6",
    language = "English",
    volume = "28",
    pages = "16433--16443",
    journal = "Journal of Materials Science: Materials in Medicine",
    issn = "0957-4530",
    publisher = "Springer Netherlands",
    number = "21",

    }

    TY - JOUR

    T1 - Low temperature Cu–Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn–Bi eutectic powders

    AU - Muhammad, Khairi Faiz

    AU - Bansho, Kazuma

    AU - Suga, Tadatomo

    AU - Miyashita, Tomoyuki

    AU - Yoshida, Makoto

    PY - 2017/11/1

    Y1 - 2017/11/1

    N2 - Fluxless bonding of plateless Cu–Cu substrates at processing temperature lower than 250 °C and low pressure of 0.1 MPa was achieved by transient liquid phase sintering (TLPS) of mixed Cu nanoparticles and Sn–Bi eutectic powders. The effects of mixture composition, and sintering temperature on the shear strength, microstructure, and remelting temperature were investigated. Lowering the sintering temperature of Cu mixed with 65 weight percentage of Sn–Bi (Cu–65SnBi) resulted in decreased shear strength, however, at 200 °C sintering temperature, the obtained highest shear strength was more than 20 MPa. It was found that it is essential to use Cu nanoparticles to accelerate the consumption so that no initial Sn–Bi phases remained after processing. The liquid phase generated at approximately 196 °C during sintering from the reaction between newly formed Cu6Sn5 and Bi-phase was expected to facilitate the densification and strengthening of the joints. Although this newly generated liquid phase was known to solidify as hypereutectic Sn–Bi, by controlling the sintering temperature at 200 °C, the remelting event at 139 °C was not observed by differential scanning calorimetry. It is assumed that the proportion of solidified Sn–Bi eutectic phases in Cu–65SnBi that was sintered at 200 °C were significantly small, hence, when reheated at 150 °C, the obtained shear strength was equivalent to that at room temperature.

    AB - Fluxless bonding of plateless Cu–Cu substrates at processing temperature lower than 250 °C and low pressure of 0.1 MPa was achieved by transient liquid phase sintering (TLPS) of mixed Cu nanoparticles and Sn–Bi eutectic powders. The effects of mixture composition, and sintering temperature on the shear strength, microstructure, and remelting temperature were investigated. Lowering the sintering temperature of Cu mixed with 65 weight percentage of Sn–Bi (Cu–65SnBi) resulted in decreased shear strength, however, at 200 °C sintering temperature, the obtained highest shear strength was more than 20 MPa. It was found that it is essential to use Cu nanoparticles to accelerate the consumption so that no initial Sn–Bi phases remained after processing. The liquid phase generated at approximately 196 °C during sintering from the reaction between newly formed Cu6Sn5 and Bi-phase was expected to facilitate the densification and strengthening of the joints. Although this newly generated liquid phase was known to solidify as hypereutectic Sn–Bi, by controlling the sintering temperature at 200 °C, the remelting event at 139 °C was not observed by differential scanning calorimetry. It is assumed that the proportion of solidified Sn–Bi eutectic phases in Cu–65SnBi that was sintered at 200 °C were significantly small, hence, when reheated at 150 °C, the obtained shear strength was equivalent to that at room temperature.

    UR - http://www.scopus.com/inward/record.url?scp=85025134443&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=85025134443&partnerID=8YFLogxK

    U2 - 10.1007/s10854-017-7554-6

    DO - 10.1007/s10854-017-7554-6

    M3 - Article

    VL - 28

    SP - 16433

    EP - 16443

    JO - Journal of Materials Science: Materials in Medicine

    JF - Journal of Materials Science: Materials in Medicine

    SN - 0957-4530

    IS - 21

    ER -