Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments

Weixin Fu, Akitsu Shigetou, Shuichi Shoji, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A direct hybrid bonding of PEEK-Pt is feasible at low temperature of 150 °C through surface treatment technologies of vacuum ultraviolet (VUV) and fast atom bombardment (FAB). The X-ray photoelectron spectroscopy showed the VUV treatment was capable of creating hydrate bridge layers on both PEEK and Pt surfaces, which were considered to form a robust bond through dehydration reactions. Shear strength test showed that the VUV-treated samples were stronger than the FAB-treated ones, and the highest strength reached 0.91 MPa, which was comparable with conventional PEEK-based direct bondings. This technology is expected to be applied in future body implantable medical micro electromechanical system devices.

Original languageEnglish
Title of host publication2016 International Conference on Electronics Packaging, ICEP 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages302-305
Number of pages4
ISBN (Electronic)9784904090176
DOIs
Publication statusPublished - 2016 Jun 7
Event2016 International Conference on Electronics Packaging, ICEP 2016 - Hokkaido, Japan
Duration: 2016 Apr 202016 Apr 22

Other

Other2016 International Conference on Electronics Packaging, ICEP 2016
CountryJapan
CityHokkaido
Period16/4/2016/4/22

Fingerprint

Polyether ether ketones
Surface treatment
Vacuum
Atoms
Hydrates
Dehydration
Shear strength
Temperature
MEMS
X ray photoelectron spectroscopy
polyetheretherketone

Keywords

  • FAB
  • Hybrid bonding
  • Hydrate bridge layer
  • Low temperature
  • PEEK
  • VUV

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Mechanics of Materials

Cite this

Fu, W., Shigetou, A., Shoji, S., & Mizuno, J. (2016). Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments. In 2016 International Conference on Electronics Packaging, ICEP 2016 (pp. 302-305). [7486834] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEP.2016.7486834

Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments. / Fu, Weixin; Shigetou, Akitsu; Shoji, Shuichi; Mizuno, Jun.

2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., 2016. p. 302-305 7486834.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fu, W, Shigetou, A, Shoji, S & Mizuno, J 2016, Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments. in 2016 International Conference on Electronics Packaging, ICEP 2016., 7486834, Institute of Electrical and Electronics Engineers Inc., pp. 302-305, 2016 International Conference on Electronics Packaging, ICEP 2016, Hokkaido, Japan, 16/4/20. https://doi.org/10.1109/ICEP.2016.7486834
Fu W, Shigetou A, Shoji S, Mizuno J. Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments. In 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc. 2016. p. 302-305. 7486834 https://doi.org/10.1109/ICEP.2016.7486834
Fu, Weixin ; Shigetou, Akitsu ; Shoji, Shuichi ; Mizuno, Jun. / Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments. 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 302-305
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