Low temperature direct bonding of polyether ether ketone (PEEK) and Pt

Weixin Fu; Akitsu Shigetou; Shuichi Shoji; Jun Mizuno

doi:10.1109/IMPACT.2015.7365179

Low temperature direct bonding of polyether ether ketone (PEEK) and Pt

Weixin Fu, Akitsu Shigetou, Shuichi Shoji, Jun Mizuno

Research Organization for Nano & Life Innovation

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

The direct bonding between polyether ether ketone (PEEK) and Pt was feasible at 150 °C via the surface modification using vacuum ultraviolet (VUV). This technology will be of practical use in the eco-friendly fabrication of light-weight and bio-inert electronic system, such as a body-implantation medical device. The VUV irradiation helped creating the bridging layers, which consisted of hydroxyl groups due to the residual water molecules inside the bonding chamber, both on PEEK and Pt surfaces. Upon heating at 150 °C, the Pt ions diffused into PEEK side as the micro-grains at the PEEK-Pt interface, and a voidless interface was successfully obtained with the calculated bonding strain release energy of around 4.2 N/m. This energy is higher than the surface energy of both PEEK and Pt.

Original language	English
Title of host publication	2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	217-220
Number of pages	4
ISBN (Print)	9781467383561
DOIs	https://doi.org/10.1109/IMPACT.2015.7365179
Publication status	Published - 2015 Dec 23
Event	10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Taipei, Taiwan, Province of China Duration: 2015 Oct 21 → 2015 Oct 23

Other

Other	10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015
Country/Territory	Taiwan, Province of China
City	Taipei
Period	15/10/21 → 15/10/23

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/IMPACT.2015.7365179

Cite this

Fu, W., Shigetou, A., Shoji, S., & Mizuno, J. (2015). Low temperature direct bonding of polyether ether ketone (PEEK) and Pt. In 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings (pp. 217-220). [7365179] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMPACT.2015.7365179

Low temperature direct bonding of polyether ether ketone (PEEK) and Pt. / Fu, Weixin; Shigetou, Akitsu; Shoji, Shuichi ; Mizuno, Jun.

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2015. p. 217-220 7365179.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Fu, W, Shigetou, A, Shoji, S & Mizuno, J 2015, Low temperature direct bonding of polyether ether ketone (PEEK) and Pt. in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings., 7365179, Institute of Electrical and Electronics Engineers Inc., pp. 217-220, 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015, Taipei, Taiwan, Province of China, 15/10/21. https://doi.org/10.1109/IMPACT.2015.7365179

@inproceedings{82bf82a482a641b1812bcd2b00b3c002,

title = "Low temperature direct bonding of polyether ether ketone (PEEK) and Pt",

abstract = "The direct bonding between polyether ether ketone (PEEK) and Pt was feasible at 150 °C via the surface modification using vacuum ultraviolet (VUV). This technology will be of practical use in the eco-friendly fabrication of light-weight and bio-inert electronic system, such as a body-implantation medical device. The VUV irradiation helped creating the bridging layers, which consisted of hydroxyl groups due to the residual water molecules inside the bonding chamber, both on PEEK and Pt surfaces. Upon heating at 150 °C, the Pt ions diffused into PEEK side as the micro-grains at the PEEK-Pt interface, and a voidless interface was successfully obtained with the calculated bonding strain release energy of around 4.2 N/m. This energy is higher than the surface energy of both PEEK and Pt.",

author = "Weixin Fu and Akitsu Shigetou and Shuichi Shoji and Jun Mizuno",

year = "2015",

month = dec,

day = "23",

doi = "10.1109/IMPACT.2015.7365179",

language = "English",

isbn = "9781467383561",

pages = "217--220",

booktitle = "2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 ; Conference date: 21-10-2015 Through 23-10-2015",

}

TY - GEN

T1 - Low temperature direct bonding of polyether ether ketone (PEEK) and Pt

AU - Fu, Weixin

AU - Shigetou, Akitsu

AU - Shoji, Shuichi

AU - Mizuno, Jun

PY - 2015/12/23

Y1 - 2015/12/23

N2 - The direct bonding between polyether ether ketone (PEEK) and Pt was feasible at 150 °C via the surface modification using vacuum ultraviolet (VUV). This technology will be of practical use in the eco-friendly fabrication of light-weight and bio-inert electronic system, such as a body-implantation medical device. The VUV irradiation helped creating the bridging layers, which consisted of hydroxyl groups due to the residual water molecules inside the bonding chamber, both on PEEK and Pt surfaces. Upon heating at 150 °C, the Pt ions diffused into PEEK side as the micro-grains at the PEEK-Pt interface, and a voidless interface was successfully obtained with the calculated bonding strain release energy of around 4.2 N/m. This energy is higher than the surface energy of both PEEK and Pt.

AB - The direct bonding between polyether ether ketone (PEEK) and Pt was feasible at 150 °C via the surface modification using vacuum ultraviolet (VUV). This technology will be of practical use in the eco-friendly fabrication of light-weight and bio-inert electronic system, such as a body-implantation medical device. The VUV irradiation helped creating the bridging layers, which consisted of hydroxyl groups due to the residual water molecules inside the bonding chamber, both on PEEK and Pt surfaces. Upon heating at 150 °C, the Pt ions diffused into PEEK side as the micro-grains at the PEEK-Pt interface, and a voidless interface was successfully obtained with the calculated bonding strain release energy of around 4.2 N/m. This energy is higher than the surface energy of both PEEK and Pt.

UR - http://www.scopus.com/inward/record.url?scp=84964285986&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84964285986&partnerID=8YFLogxK

U2 - 10.1109/IMPACT.2015.7365179

DO - 10.1109/IMPACT.2015.7365179

M3 - Conference contribution

AN - SCOPUS:84964285986

SN - 9781467383561

SP - 217

EP - 220

BT - 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015

Y2 - 21 October 2015 through 23 October 2015

ER -

Low temperature direct bonding of polyether ether ketone (PEEK) and Pt

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