Low temperature direct bonding of polyether ether ketone (PEEK) and Pt

Weixin Fu, Akitsu Shigetou, Shuichi Shoji, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The direct bonding between polyether ether ketone (PEEK) and Pt was feasible at 150 °C via the surface modification using vacuum ultraviolet (VUV). This technology will be of practical use in the eco-friendly fabrication of light-weight and bio-inert electronic system, such as a body-implantation medical device. The VUV irradiation helped creating the bridging layers, which consisted of hydroxyl groups due to the residual water molecules inside the bonding chamber, both on PEEK and Pt surfaces. Upon heating at 150 °C, the Pt ions diffused into PEEK side as the micro-grains at the PEEK-Pt interface, and a voidless interface was successfully obtained with the calculated bonding strain release energy of around 4.2 N/m. This energy is higher than the surface energy of both PEEK and Pt.

Original languageEnglish
Title of host publication2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages217-220
Number of pages4
ISBN (Print)9781467383561
DOIs
Publication statusPublished - 2015 Dec 23
Event10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Taipei, Taiwan, Province of China
Duration: 2015 Oct 212015 Oct 23

Other

Other10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015
CountryTaiwan, Province of China
CityTaipei
Period15/10/2115/10/23

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Fu, W., Shigetou, A., Shoji, S., & Mizuno, J. (2015). Low temperature direct bonding of polyether ether ketone (PEEK) and Pt. In 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings (pp. 217-220). [7365179] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMPACT.2015.7365179