Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

Weixin Fu, Hiroyuki Kuwae, Bo Ma, Shuichi Shoji, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O3) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both APTES and GOPTS modifications were successful. The bonding reached an average bonding strength of 0.37 MPa, and bulk fracture was observed after the debonding test. Surface observation results showed VUV activation process time played an important role in bonding. This technology is expected to be applied in future bio-inert electron devices.

Original languageEnglish
Title of host publication2017 International Conference on Electronics Packaging, ICEP 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages167-170
Number of pages4
ISBN (Electronic)9784990218836
DOIs
Publication statusPublished - 2017 Jun 5
Event2017 International Conference on Electronics Packaging, ICEP 2017 - Tendo, Yamagata, Japan
Duration: 2017 Apr 192017 Apr 22

Other

Other2017 International Conference on Electronics Packaging, ICEP 2017
CountryJapan
CityTendo, Yamagata
Period17/4/1917/4/22

Keywords

  • direct bonding
  • low temperature bonding
  • polyoxymethylene
  • self-assembled monolayer
  • VUV

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Fu, W., Kuwae, H., Ma, B., Shoji, S., & Mizuno, J. (2017). Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM). In 2017 International Conference on Electronics Packaging, ICEP 2017 (pp. 167-170). [7939349] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2017.7939349