Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O3) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both APTES and GOPTS modifications were successful. The bonding reached an average bonding strength of 0.37 MPa, and bulk fracture was observed after the debonding test. Surface observation results showed VUV activation process time played an important role in bonding. This technology is expected to be applied in future bio-inert electron devices.

Original languageEnglish
Title of host publication2017 International Conference on Electronics Packaging, ICEP 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages167-170
Number of pages4
ISBN (Electronic)9784990218836
DOIs
Publication statusPublished - 2017 Jun 5
Event2017 International Conference on Electronics Packaging, ICEP 2017 - Tendo, Yamagata, Japan
Duration: 2017 Apr 192017 Apr 22

Other

Other2017 International Conference on Electronics Packaging, ICEP 2017
CountryJapan
CityTendo, Yamagata
Period17/4/1917/4/22

Fingerprint

Self assembly
Monolayers
Electron devices
Temperature
Debonding
Fourier transform infrared spectroscopy
Gases
Chemical activation
Irradiation
Vacuum
Oxygen
delrin
Substrates
amino-propyl-triethoxysilane
trimethoxysilane

Keywords

  • direct bonding
  • low temperature bonding
  • polyoxymethylene
  • self-assembled monolayer
  • VUV

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Fu, W., Kuwae, H., Ma, B., Shoji, S., & Mizuno, J. (2017). Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM). In 2017 International Conference on Electronics Packaging, ICEP 2017 (pp. 167-170). [7939349] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2017.7939349

Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM). / Fu, Weixin; Kuwae, Hiroyuki; Ma, Bo; Shoji, Shuichi; Mizuno, Jun.

2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 167-170 7939349.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fu, W, Kuwae, H, Ma, B, Shoji, S & Mizuno, J 2017, Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM). in 2017 International Conference on Electronics Packaging, ICEP 2017., 7939349, Institute of Electrical and Electronics Engineers Inc., pp. 167-170, 2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Yamagata, Japan, 17/4/19. https://doi.org/10.23919/ICEP.2017.7939349
Fu W, Kuwae H, Ma B, Shoji S, Mizuno J. Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM). In 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 167-170. 7939349 https://doi.org/10.23919/ICEP.2017.7939349
Fu, Weixin ; Kuwae, Hiroyuki ; Ma, Bo ; Shoji, Shuichi ; Mizuno, Jun. / Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM). 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 167-170
@inproceedings{bf2d03aa2a004137a2804669e128fe2d,
title = "Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)",
abstract = "Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O3) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both APTES and GOPTS modifications were successful. The bonding reached an average bonding strength of 0.37 MPa, and bulk fracture was observed after the debonding test. Surface observation results showed VUV activation process time played an important role in bonding. This technology is expected to be applied in future bio-inert electron devices.",
keywords = "direct bonding, low temperature bonding, polyoxymethylene, self-assembled monolayer, VUV",
author = "Weixin Fu and Hiroyuki Kuwae and Bo Ma and Shuichi Shoji and Jun Mizuno",
year = "2017",
month = "6",
day = "5",
doi = "10.23919/ICEP.2017.7939349",
language = "English",
pages = "167--170",
booktitle = "2017 International Conference on Electronics Packaging, ICEP 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
address = "United States",

}

TY - GEN

T1 - Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

AU - Fu, Weixin

AU - Kuwae, Hiroyuki

AU - Ma, Bo

AU - Shoji, Shuichi

AU - Mizuno, Jun

PY - 2017/6/5

Y1 - 2017/6/5

N2 - Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O3) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both APTES and GOPTS modifications were successful. The bonding reached an average bonding strength of 0.37 MPa, and bulk fracture was observed after the debonding test. Surface observation results showed VUV activation process time played an important role in bonding. This technology is expected to be applied in future bio-inert electron devices.

AB - Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O3) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both APTES and GOPTS modifications were successful. The bonding reached an average bonding strength of 0.37 MPa, and bulk fracture was observed after the debonding test. Surface observation results showed VUV activation process time played an important role in bonding. This technology is expected to be applied in future bio-inert electron devices.

KW - direct bonding

KW - low temperature bonding

KW - polyoxymethylene

KW - self-assembled monolayer

KW - VUV

UR - http://www.scopus.com/inward/record.url?scp=85021404426&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85021404426&partnerID=8YFLogxK

U2 - 10.23919/ICEP.2017.7939349

DO - 10.23919/ICEP.2017.7939349

M3 - Conference contribution

AN - SCOPUS:85021404426

SP - 167

EP - 170

BT - 2017 International Conference on Electronics Packaging, ICEP 2017

PB - Institute of Electrical and Electronics Engineers Inc.

ER -