Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects

Hayata Mimatsu, Jun Mizuno, Takashi Kasahara, Mikiko Saito, Shuichi Shoji, Hiroshi Nishikawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

We proposed low-temperature Au-Au bump interconnects bonding using nanoporous Au-Ag powders as a connective adhesion. The nanoporous powders were formed by de-alloying Au-Ag alloy in HNO3 solution. To optimize the pore size, the influence of the annealing temperature on the porous structures was investigated. Selective transfer of the nanoporous powders on bumps was obtained by stamping process. Bonding strength of about 2.4 MPa was achieved at 150°C by using nanoporous Au-Ag powders. Bonding interface was evaluated by scanning acoustic microscope and scanning electron microscopy. This result indicated that the nanoporous powder is a useful material for low-temperature Au-Au bonding.

Original languageEnglish
Title of host publicationProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1131-1134
Number of pages4
ISBN (Print)9781479935086
DOIs
Publication statusPublished - 2014
Event27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 - San Francisco, CA
Duration: 2014 Jan 262014 Jan 30

Other

Other27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
CitySan Francisco, CA
Period14/1/2614/1/30

Fingerprint

Gold
Powders
gold
Temperature
Acoustic microscopes
acoustic microscopes
stamping
Stamping
Alloying
alloying
Pore size
adhesion
Adhesion
Annealing
Scanning
porosity
Scanning electron microscopy
scanning electron microscopy
annealing
scanning

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Mimatsu, H., Mizuno, J., Kasahara, T., Saito, M., Shoji, S., & Nishikawa, H. (2014). Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) (pp. 1131-1134). [6765845] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2014.6765845

Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects. / Mimatsu, Hayata; Mizuno, Jun; Kasahara, Takashi; Saito, Mikiko; Shoji, Shuichi; Nishikawa, Hiroshi.

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). Institute of Electrical and Electronics Engineers Inc., 2014. p. 1131-1134 6765845.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mimatsu, H, Mizuno, J, Kasahara, T, Saito, M, Shoji, S & Nishikawa, H 2014, Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects. in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)., 6765845, Institute of Electrical and Electronics Engineers Inc., pp. 1131-1134, 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014, San Francisco, CA, 14/1/26. https://doi.org/10.1109/MEMSYS.2014.6765845
Mimatsu H, Mizuno J, Kasahara T, Saito M, Shoji S, Nishikawa H. Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). Institute of Electrical and Electronics Engineers Inc. 2014. p. 1131-1134. 6765845 https://doi.org/10.1109/MEMSYS.2014.6765845
Mimatsu, Hayata ; Mizuno, Jun ; Kasahara, Takashi ; Saito, Mikiko ; Shoji, Shuichi ; Nishikawa, Hiroshi. / Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). Institute of Electrical and Electronics Engineers Inc., 2014. pp. 1131-1134
@inproceedings{e3cee432fbbf4b87841c6e14bbb7553b,
title = "Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects",
abstract = "We proposed low-temperature Au-Au bump interconnects bonding using nanoporous Au-Ag powders as a connective adhesion. The nanoporous powders were formed by de-alloying Au-Ag alloy in HNO3 solution. To optimize the pore size, the influence of the annealing temperature on the porous structures was investigated. Selective transfer of the nanoporous powders on bumps was obtained by stamping process. Bonding strength of about 2.4 MPa was achieved at 150°C by using nanoporous Au-Ag powders. Bonding interface was evaluated by scanning acoustic microscope and scanning electron microscopy. This result indicated that the nanoporous powder is a useful material for low-temperature Au-Au bonding.",
author = "Hayata Mimatsu and Jun Mizuno and Takashi Kasahara and Mikiko Saito and Shuichi Shoji and Hiroshi Nishikawa",
year = "2014",
doi = "10.1109/MEMSYS.2014.6765845",
language = "English",
isbn = "9781479935086",
pages = "1131--1134",
booktitle = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - GEN

T1 - Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects

AU - Mimatsu, Hayata

AU - Mizuno, Jun

AU - Kasahara, Takashi

AU - Saito, Mikiko

AU - Shoji, Shuichi

AU - Nishikawa, Hiroshi

PY - 2014

Y1 - 2014

N2 - We proposed low-temperature Au-Au bump interconnects bonding using nanoporous Au-Ag powders as a connective adhesion. The nanoporous powders were formed by de-alloying Au-Ag alloy in HNO3 solution. To optimize the pore size, the influence of the annealing temperature on the porous structures was investigated. Selective transfer of the nanoporous powders on bumps was obtained by stamping process. Bonding strength of about 2.4 MPa was achieved at 150°C by using nanoporous Au-Ag powders. Bonding interface was evaluated by scanning acoustic microscope and scanning electron microscopy. This result indicated that the nanoporous powder is a useful material for low-temperature Au-Au bonding.

AB - We proposed low-temperature Au-Au bump interconnects bonding using nanoporous Au-Ag powders as a connective adhesion. The nanoporous powders were formed by de-alloying Au-Ag alloy in HNO3 solution. To optimize the pore size, the influence of the annealing temperature on the porous structures was investigated. Selective transfer of the nanoporous powders on bumps was obtained by stamping process. Bonding strength of about 2.4 MPa was achieved at 150°C by using nanoporous Au-Ag powders. Bonding interface was evaluated by scanning acoustic microscope and scanning electron microscopy. This result indicated that the nanoporous powder is a useful material for low-temperature Au-Au bonding.

UR - http://www.scopus.com/inward/record.url?scp=84899018326&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84899018326&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2014.6765845

DO - 10.1109/MEMSYS.2014.6765845

M3 - Conference contribution

AN - SCOPUS:84899018326

SN - 9781479935086

SP - 1131

EP - 1134

BT - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

PB - Institute of Electrical and Electronics Engineers Inc.

ER -