Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects

Hayata Mimatsu, Jun Mizuno, Takashi Kasahara, Mikiko Saito, Shuichi Shoji, Hiroshi Nishikawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

We proposed low-temperature Au-Au bump interconnects bonding using nanoporous Au-Ag powders as a connective adhesion. The nanoporous powders were formed by de-alloying Au-Ag alloy in HNO3 solution. To optimize the pore size, the influence of the annealing temperature on the porous structures was investigated. Selective transfer of the nanoporous powders on bumps was obtained by stamping process. Bonding strength of about 2.4 MPa was achieved at 150°C by using nanoporous Au-Ag powders. Bonding interface was evaluated by scanning acoustic microscope and scanning electron microscopy. This result indicated that the nanoporous powder is a useful material for low-temperature Au-Au bonding.

Original languageEnglish
Title of host publicationMEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1131-1134
Number of pages4
ISBN (Print)9781479935086
DOIs
Publication statusPublished - 2014 Jan 1
Event27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 - San Francisco, CA, United States
Duration: 2014 Jan 262014 Jan 30

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Conference

Conference27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
CountryUnited States
CitySan Francisco, CA
Period14/1/2614/1/30

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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    Mimatsu, H., Mizuno, J., Kasahara, T., Saito, M., Shoji, S., & Nishikawa, H. (2014). Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects. In MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems (pp. 1131-1134). [6765845] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2014.6765845