Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects

Hayata Mimatsu, Jun Mizuno, Takashi Kasahara, Mikiko Saito, Shuichi Shoji, Hiroshi Nishikawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects'. Together they form a unique fingerprint.

Engineering & Materials Science

Physics & Astronomy

Chemical Compounds