TY - JOUR
T1 - Low-Temperature Growth of Carbon Nanotube Forests Consisting of Tubes with Narrow Inner Spacing Using Co/Al/Mo Catalyst on Conductive Supports
AU - Sugime, Hisashi
AU - Esconjauregui, Santiago
AU - D'Arsié, Lorenzo
AU - Yang, Junwei
AU - Robertson, Alex W.
AU - Oliver, Rachel A.
AU - Bhardwaj, Sunil
AU - Cepek, Cinzia
AU - Robertson, John
N1 - Publisher Copyright:
© 2015 American Chemical Society.
PY - 2015/8/5
Y1 - 2015/8/5
N2 - We grow dense carbon nanotube forests at 450 °C on Cu support using Co/Al/Mo multilayer catalyst. As a partial barrier layer for the diffusion of Co into Mo, we apply very thin Al layer with the nominal thickness of 0.50 nm between Co and Mo. This Al layer plays an important role in the growth of dense CNT forests, partially preventing the Co-Mo interaction. The forests have an average height of ∼300 nm and a mass density of 1.2 g cm-3 with tubes exhibiting extremely narrow inner spacing. An ohmic behavior is confirmed between the forest and Cu support with the lowest resistance of ∼8 kΩ. The forest shows a high thermal effusivity of 1840 J s-0.5 m-2 K-1, and a thermal conductivity of 4.0 J s-1 m-1 K-1, suggesting that these forests are useful for heat dissipation devices. (Figure Presented).
AB - We grow dense carbon nanotube forests at 450 °C on Cu support using Co/Al/Mo multilayer catalyst. As a partial barrier layer for the diffusion of Co into Mo, we apply very thin Al layer with the nominal thickness of 0.50 nm between Co and Mo. This Al layer plays an important role in the growth of dense CNT forests, partially preventing the Co-Mo interaction. The forests have an average height of ∼300 nm and a mass density of 1.2 g cm-3 with tubes exhibiting extremely narrow inner spacing. An ohmic behavior is confirmed between the forest and Cu support with the lowest resistance of ∼8 kΩ. The forest shows a high thermal effusivity of 1840 J s-0.5 m-2 K-1, and a thermal conductivity of 4.0 J s-1 m-1 K-1, suggesting that these forests are useful for heat dissipation devices. (Figure Presented).
KW - catalyst nanoparticles
KW - chemical vapor deposition
KW - cocatalyst
KW - low-temperature growth
KW - sputtering
KW - thermal conductivity
KW - thermal effusivity
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U2 - 10.1021/acsami.5b04846
DO - 10.1021/acsami.5b04846
M3 - Article
AN - SCOPUS:84938592942
VL - 7
SP - 16819
EP - 16827
JO - ACS applied materials & interfaces
JF - ACS applied materials & interfaces
SN - 1944-8244
IS - 30
ER -