Low temperature, low pressure, fluxless and plateless Cu-Cu bonding by Cu nano particle transient liquid phase sintering

Takehiro Yamamoto, Khairi Faiz Muhammad, Tadatomo Suga, Tomoyuki Miyashita, Makoto Yoshida

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    In this work, low temperature of 200°C, low pressure of 0.1MPa, fluxless and plateless Cu-Cu bonding in SiC power module is achieved by the transient phase liquid sintering (TLPS) of Cu nano particle and Sn-Bi eutectic powder. In this paper, shear strength at room temperature and 150°C of two compositions of Cu mixed with Sn-Bi is investigated and the factor influencing the shear strength at 150°C is examined by means of differential scanning calorimetry (DSC). In 70 mass% added Sn-Bi (Cu-70SnBi), which was sintered at 200°C, the remelting event at 139°C occurred due to the residual Sn-Bi eutectic phase and assumed to result in the decrease of shear strength at 150°C. On contrary, in 65 mass% added Sn-Bi (Cu-65SnBi), which was sintered at the same conditions, remelting event at 139°C was not observed, and the obtained shear strength at 150°C was almost similar to that of at room temperature (R. T.).

    Original languageEnglish
    Title of host publication2017 IEEE CPMT Symposium Japan, ICSJ 2017
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages139-140
    Number of pages2
    Volume2017-January
    ISBN (Electronic)9781538627129
    DOIs
    Publication statusPublished - 2017 Dec 26
    Event2017 IEEE CPMT Symposium Japan, ICSJ 2017 - Kyoto, Japan
    Duration: 2017 Nov 202017 Nov 22

    Other

    Other2017 IEEE CPMT Symposium Japan, ICSJ 2017
    CountryJapan
    CityKyoto
    Period17/11/2017/11/22

    Fingerprint

    Liquid phase sintering
    Shear strength
    Remelting
    Eutectics
    Temperature
    Powders
    Differential scanning calorimetry
    Chemical analysis

    Keywords

    • Cu nano particle
    • Sn-Bi
    • transient liquid phase sintering

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials

    Cite this

    Yamamoto, T., Muhammad, K. F., Suga, T., Miyashita, T., & Yoshida, M. (2017). Low temperature, low pressure, fluxless and plateless Cu-Cu bonding by Cu nano particle transient liquid phase sintering. In 2017 IEEE CPMT Symposium Japan, ICSJ 2017 (Vol. 2017-January, pp. 139-140). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSJ.2017.8240132

    Low temperature, low pressure, fluxless and plateless Cu-Cu bonding by Cu nano particle transient liquid phase sintering. / Yamamoto, Takehiro; Muhammad, Khairi Faiz; Suga, Tadatomo; Miyashita, Tomoyuki; Yoshida, Makoto.

    2017 IEEE CPMT Symposium Japan, ICSJ 2017. Vol. 2017-January Institute of Electrical and Electronics Engineers Inc., 2017. p. 139-140.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Yamamoto, T, Muhammad, KF, Suga, T, Miyashita, T & Yoshida, M 2017, Low temperature, low pressure, fluxless and plateless Cu-Cu bonding by Cu nano particle transient liquid phase sintering. in 2017 IEEE CPMT Symposium Japan, ICSJ 2017. vol. 2017-January, Institute of Electrical and Electronics Engineers Inc., pp. 139-140, 2017 IEEE CPMT Symposium Japan, ICSJ 2017, Kyoto, Japan, 17/11/20. https://doi.org/10.1109/ICSJ.2017.8240132
    Yamamoto T, Muhammad KF, Suga T, Miyashita T, Yoshida M. Low temperature, low pressure, fluxless and plateless Cu-Cu bonding by Cu nano particle transient liquid phase sintering. In 2017 IEEE CPMT Symposium Japan, ICSJ 2017. Vol. 2017-January. Institute of Electrical and Electronics Engineers Inc. 2017. p. 139-140 https://doi.org/10.1109/ICSJ.2017.8240132
    Yamamoto, Takehiro ; Muhammad, Khairi Faiz ; Suga, Tadatomo ; Miyashita, Tomoyuki ; Yoshida, Makoto. / Low temperature, low pressure, fluxless and plateless Cu-Cu bonding by Cu nano particle transient liquid phase sintering. 2017 IEEE CPMT Symposium Japan, ICSJ 2017. Vol. 2017-January Institute of Electrical and Electronics Engineers Inc., 2017. pp. 139-140
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