Low-temperature poly(oxymethylene) direct bonding via self-assembled monolayer

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

A direct bonding of poly(oxymethylene) (POM) was feasible at 100 °C by using self-assembled monolayer (SAM) as a surface modification method. (3-aminopropyl)triethoxysilane (APTES) and (3-glycidyloxypropyl)trimethoxysilane (GOPTS) were used in our work. X-ray photoelectron spectroscopy showed that both APTES and GOPTS modified the POM surface successfully. Bonding strength evaluation revealed that surface modification was affected by pretreatment (VUV/O3) process time. In addition, the bonding condition with highest strength had an average strength of 372 kPa. This technology is expected to be used in packaging for micro-/nano-electromechanical systems, such as biomedical devices.

Original languageEnglish
Article number02BB01
JournalJapanese Journal of Applied Physics
Volume57
Issue number2
DOIs
Publication statusPublished - 2018 Feb 1

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Self assembled monolayers
Surface treatment
high strength
packaging
pretreatment
Temperature
Packaging
X ray photoelectron spectroscopy
photoelectron spectroscopy
evaluation
x rays

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Low-temperature poly(oxymethylene) direct bonding via self-assembled monolayer. / Fu, Weixin; Ma, Bo; Kuwae, Hiroyuki; Shoji, Shuichi; Mizuno, Jun.

In: Japanese Journal of Applied Physics, Vol. 57, No. 2, 02BB01, 01.02.2018.

Research output: Contribution to journalArticle

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