Low-temperature, surface-compliant wafer bonding using sub-micron gold particles for wafer-level MEMS packaging

Hiroyuki Ishida, Toshinori Ogashiwa, Yukio Kanehira, Shin Ito, Takuya Yazaki, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

Low-temperature wafer bonding using sub-micron gold particles was investigated. For more flexible bonding pattern deposition, wafer-level pattern transfer method has been developed to enable patterning on fragile structures such as MEMS devices. Sub-micron Au particle patterns with a width of 20 μm-60 μm and a height around 20 μm were formed on 100mm-diameter glass wafers by means of wafer-level processing using photolithography and a slurry-filling technique, and then successfully transferred onto Si wafers in ambient atmosphere at a temperature of 150°C and an applied pressure of 20 MPa-30 MPa. Finally, wafer bonding was performed at 200°C, 100 MPa and confirmed a sufficient tensile strength of 45.8 MPa. Compression deformation measurement was performed and the performance on a-few-μm surface roughness absorption was demonstrated. A feasibility of further reduction of bonding temperature has been suggested by showing sintering behavior of smaller-sized Au particles at 150°C.

Original languageEnglish
Title of host publication2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Pages1140-1145
Number of pages6
DOIs
Publication statusPublished - 2012 Oct 4
Event2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 - San Diego, CA, United States
Duration: 2012 May 292012 Jun 1

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
CountryUnited States
CitySan Diego, CA
Period12/5/2912/6/1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Ishida, H., Ogashiwa, T., Kanehira, Y., Ito, S., Yazaki, T., & Mizuno, J. (2012). Low-temperature, surface-compliant wafer bonding using sub-micron gold particles for wafer-level MEMS packaging. In 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 (pp. 1140-1145). [6248979] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2012.6248979