Low-temperature, surface-compliant wafer bonding using sub-micron gold particles for wafer-level MEMS packaging

Hiroyuki Ishida, Toshinori Ogashiwa, Yukio Kanehira, Shin Ito, Takuya Yazaki, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds