Low-temperature wafer bonding for MEMS packaging utilizing screen-printed sub-micron size Au particle patterns

S. Ishizuka; N. Akiyama; T. Ogashiwa; T. Nishimori; H. Ishida; S. Shoji; J. Mizuno

doi:10.1016/j.mee.2011.02.083

Low-temperature wafer bonding for MEMS packaging utilizing screen-printed sub-micron size Au particle patterns

S. Ishizuka^*, N. Akiyama, T. Ogashiwa, T. Nishimori, H. Ishida, S. Shoji, J. Mizuno

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

In this study, a new wafer bonding method for MEMS (micro electro mechanical systems) packaging is presented. The seal lines of sub-micron size Au particles with a width of 50 μm were formed on wafers by means of screen-printing. The bonding process was carried out at 300°C under reduced pressure, 1 × 10^-3 mbar. The bonded wafers were diced into 5 mm × 5 mm individual chips. The bond strength of each chips was about 20 MPa measured by a tensile test and about 40 MPa by a shear test in the average. It was confirmed that two wafers were successfully bonded with screen-printed Au particle seal lines. The proposed method can be applied to practical MEMS packaging.

Original language	English
Pages (from-to)	2275-2277
Number of pages	3
Journal	Microelectronic Engineering
Volume	88
Issue number	8
DOIs	https://doi.org/10.1016/j.mee.2011.02.083
Publication status	Published - 2011 Aug

Keywords

Au bonding
MEMS
Screen printing
Wafer bonding

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Surfaces, Coatings and Films
Electrical and Electronic Engineering

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10.1016/j.mee.2011.02.083

Cite this

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title = "Low-temperature wafer bonding for MEMS packaging utilizing screen-printed sub-micron size Au particle patterns",

abstract = "In this study, a new wafer bonding method for MEMS (micro electro mechanical systems) packaging is presented. The seal lines of sub-micron size Au particles with a width of 50 μm were formed on wafers by means of screen-printing. The bonding process was carried out at 300°C under reduced pressure, 1 × 10-3 mbar. The bonded wafers were diced into 5 mm × 5 mm individual chips. The bond strength of each chips was about 20 MPa measured by a tensile test and about 40 MPa by a shear test in the average. It was confirmed that two wafers were successfully bonded with screen-printed Au particle seal lines. The proposed method can be applied to practical MEMS packaging.",

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AU - Ishizuka, S.

AU - Akiyama, N.

AU - Ogashiwa, T.

AU - Nishimori, T.

AU - Ishida, H.

AU - Shoji, S.

AU - Mizuno, J.

PY - 2011/8

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AB - In this study, a new wafer bonding method for MEMS (micro electro mechanical systems) packaging is presented. The seal lines of sub-micron size Au particles with a width of 50 μm were formed on wafers by means of screen-printing. The bonding process was carried out at 300°C under reduced pressure, 1 × 10-3 mbar. The bonded wafers were diced into 5 mm × 5 mm individual chips. The bond strength of each chips was about 20 MPa measured by a tensile test and about 40 MPa by a shear test in the average. It was confirmed that two wafers were successfully bonded with screen-printed Au particle seal lines. The proposed method can be applied to practical MEMS packaging.

KW - Au bonding

KW - MEMS

KW - Screen printing

KW - Wafer bonding

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Low-temperature wafer bonding for MEMS packaging utilizing screen-printed sub-micron size Au particle patterns

Abstract

Keywords

ASJC Scopus subject areas

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