Low-temperature wafer bonding for MEMS packaging utilizing screen-printed sub-micron size Au particle patterns

S. Ishizuka, N. Akiyama, T. Ogashiwa, T. Nishimori, H. Ishida, S. Shoji, J. Mizuno

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

In this study, a new wafer bonding method for MEMS (micro electro mechanical systems) packaging is presented. The seal lines of sub-micron size Au particles with a width of 50 μm were formed on wafers by means of screen-printing. The bonding process was carried out at 300°C under reduced pressure, 1 × 10-3 mbar. The bonded wafers were diced into 5 mm × 5 mm individual chips. The bond strength of each chips was about 20 MPa measured by a tensile test and about 40 MPa by a shear test in the average. It was confirmed that two wafers were successfully bonded with screen-printed Au particle seal lines. The proposed method can be applied to practical MEMS packaging.

Original languageEnglish
Pages (from-to)2275-2277
Number of pages3
JournalMicroelectronic Engineering
Volume88
Issue number8
DOIs
Publication statusPublished - 2011 Aug 1

Keywords

  • Au bonding
  • MEMS
  • Screen printing
  • Wafer bonding

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Low-temperature wafer bonding for MEMS packaging utilizing screen-printed sub-micron size Au particle patterns'. Together they form a unique fingerprint.

Cite this