Low-temperature wafer bonding using sub-micron gold particles for wafer-level MEMS packaging

H. Ishida, T. Ogashiwa, Y. Kanehira, S. Ito, T. Yazaki, J. Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Low-temperature wafer bonding using sub-m gold particles together with wafer-level pattern transfer method has been developed. Sub-m Au particle patterns were successfully transferred at 150°C and wafer bonding was performed at 200°C. Surface compliant performance was demonstrated by compression deformation measurement.

Original languageEnglish
Title of host publicationProceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Number of pages1
DOIs
Publication statusPublished - 2012 Aug 15
Event2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan
Duration: 2012 May 222012 May 23

Publication series

NameProceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Other

Other2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
CountryJapan
CityTokyo
Period12/5/2212/5/23

ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design
  • Computer Vision and Pattern Recognition

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