Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding

T. Yokoshima, Y. Yamaji, N. Igawa, K. Kikuchi, H. Nakagawa, M. Aoyagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Deposition behavior of localized electroless NiB deposition for pad-to-pad connection was investigated. Localized deposition occurred mainly on the area between facing pads, and anisotropic deposition toward each facing pad was obtained. Thus, this connection, "preferential bridge connection", is no need of photolithographic technique. These results indicated that this process is one of the maskless fabrication processes. Moreover, chemical flip-chip bonding containing preferential bridge interconnection was demonstrated. The chip-to-substrate interconnection with 30 μm pitch was successfully achieved.

Original languageEnglish
Title of host publicationECS Transactions - Electronics Packaging 3 - 214th ECS Meeting
Pages77-85
Number of pages9
Edition22
DOIs
Publication statusPublished - 2009 Nov 23
Externally publishedYes
EventElectronics Packaging 3 - 214th ECS Meeting - Honolulu, HI, United States
Duration: 2008 Oct 122008 Oct 17

Publication series

NameECS Transactions
Number22
Volume16
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferenceElectronics Packaging 3 - 214th ECS Meeting
CountryUnited States
CityHonolulu, HI
Period08/10/1208/10/17

ASJC Scopus subject areas

  • Engineering(all)

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    Yokoshima, T., Yamaji, Y., Igawa, N., Kikuchi, K., Nakagawa, H., & Aoyagi, M. (2009). Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding. In ECS Transactions - Electronics Packaging 3 - 214th ECS Meeting (22 ed., pp. 77-85). (ECS Transactions; Vol. 16, No. 22). https://doi.org/10.1149/1.3115653