Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding

Tokihiko Yokoshima, Y. Yamaji, N. Igawa, K. Kikuchi, H. Nakagawa, M. Aoyagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Deposition behavior of localized electroless NiB deposition for pad-to-pad connection was investigated. Localized deposition occurred mainly on the area between facing pads, and anisotropic deposition toward each facing pad was obtained. Thus, this connection, "preferential bridge connection", is no need of photolithographic technique. These results indicated that this process is one of the maskless fabrication processes. Moreover, chemical flip-chip bonding containing preferential bridge interconnection was demonstrated. The chip-to-substrate interconnection with 30 μm pitch was successfully achieved.

Original languageEnglish
Title of host publicationECS Transactions
Pages77-85
Number of pages9
Volume16
Edition22
DOIs
Publication statusPublished - 2009
Externally publishedYes
EventElectronics Packaging 3 - 214th ECS Meeting - Honolulu, HI
Duration: 2008 Oct 122008 Oct 17

Other

OtherElectronics Packaging 3 - 214th ECS Meeting
CityHonolulu, HI
Period08/10/1208/10/17

Fingerprint

Electroless plating
Fabrication
Substrates

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Yokoshima, T., Yamaji, Y., Igawa, N., Kikuchi, K., Nakagawa, H., & Aoyagi, M. (2009). Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding. In ECS Transactions (22 ed., Vol. 16, pp. 77-85) https://doi.org/10.1149/1.3115653

Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding. / Yokoshima, Tokihiko; Yamaji, Y.; Igawa, N.; Kikuchi, K.; Nakagawa, H.; Aoyagi, M.

ECS Transactions. Vol. 16 22. ed. 2009. p. 77-85.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yokoshima, T, Yamaji, Y, Igawa, N, Kikuchi, K, Nakagawa, H & Aoyagi, M 2009, Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding. in ECS Transactions. 22 edn, vol. 16, pp. 77-85, Electronics Packaging 3 - 214th ECS Meeting, Honolulu, HI, 08/10/12. https://doi.org/10.1149/1.3115653
Yokoshima, Tokihiko ; Yamaji, Y. ; Igawa, N. ; Kikuchi, K. ; Nakagawa, H. ; Aoyagi, M. / Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding. ECS Transactions. Vol. 16 22. ed. 2009. pp. 77-85
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