Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding

T. Yokoshima*, Y. Yamaji, N. Igawa, K. Kikuchi, H. Nakagawa, M. Aoyagi

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

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Engineering & Materials Science