Mechanical Properties of a Partially Solidified Cu-Zn Alloy

Naoki Kasuya, Tomoaki Nakazawa, Akira Matsushita, Toshimitsu Okane, Makoto Yoshida

    Research output: Contribution to journalArticle

    4 Citations (Scopus)

    Abstract

    For predicting solidification cracking by thermal stress analysis, the mechanical properties in the partially solidified state based on the experimental results are the best hope. However, the Young’s modulus has never been investigated for copper alloys. In this study, stress–strain curves of a Cu-Zn alloy in the partially solidified state for various solid fractions were obtained using a specially developed horizontal tensile test device. Furthermore, by removing the load during the tensile test, the spring-back (elastic behavior) was observed and the Young’s modulus was obtained.

    Original languageEnglish
    Pages (from-to)1-7
    Number of pages7
    JournalMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
    DOIs
    Publication statusAccepted/In press - 2016 Feb 3

    Fingerprint

    tensile tests
    modulus of elasticity
    Elastic moduli
    mechanical properties
    Mechanical properties
    copper alloys
    stress analysis
    Copper alloys
    thermal stresses
    Stress analysis
    Thermal stress
    solidification
    Solidification
    curves

    ASJC Scopus subject areas

    • Condensed Matter Physics
    • Metals and Alloys
    • Mechanics of Materials

    Cite this

    Mechanical Properties of a Partially Solidified Cu-Zn Alloy. / Kasuya, Naoki; Nakazawa, Tomoaki; Matsushita, Akira; Okane, Toshimitsu; Yoshida, Makoto.

    In: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 03.02.2016, p. 1-7.

    Research output: Contribution to journalArticle

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    AU - Yoshida, Makoto

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