Mechanism of low temperature sintering-bonding through in-situ formation of silver nanoparticles using silver oxide microparticles

Fengwen Mu, Zhenyu Zhao, Guisheng Zou, Hailin Bai, Aiping Wu, Lei Liu, Dongyue Zhang, Y. Norman Zhou

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

In this paper, a low temperature sintering-bonding process through in-situ formation of silver (Ag) nanoparticles using silveroxide (Ag2O) microparticles was studied. The Ag2O powders were mixed with triethylene glycol (TEG) to form a paste, which was used to bond the Ag-coated copper (Cu) bulks. The results revealed that high temperature was helpful to increase the bond strength, and the joints average shear strength can reach 21.9MPa at 523K under 2 MPa for 5 min. And the mechanism of the reaction and sintering bonding process were basically made clear by using TGA-FTIR, FE-SEM and XRD, further, a reasonable sintering-bonding model was proposed.

Original languageEnglish
Pages (from-to)872-878
Number of pages7
JournalMaterials Transactions
Volume54
Issue number6
DOIs
Publication statusPublished - 2013 Jun 18
Externally publishedYes

Keywords

  • In-situ formation
  • Mechanism
  • Silver oxide
  • Sintering-bonding

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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