Mechanism of Sulfur Inclusion in Soft Gold Electrodeposited from the Thiosulfate-Sulfite Bath

Tetsuya Osaka, M. Kato, J. Sato, K. Yoshizawa, Takayuki Homma, Y. Okinaka, O. Yoshioka

Research output: Contribution to journalArticle

34 Citations (Scopus)

Abstract

The hardness of the soft gold electrodeposited from the thiosulfate-sulfite mixed ligand with which we developed recently, has previously been found to increase with increasing sulfur content of the gold deposit. In the present study the mechanism of the sulfur inclusion was investigated by analyzing for sulfur gold deposits produced under various experimental conditions and also by observing weight gains resulting from the adsorption of sulfur-containing species on gold using the quartz crystal microbalance (QCM) technique. The results led us to conclude that the origin of the included sulfur is primarily the adsorbed Au(I)-thiosulfate species, (Au 2S 2O 3) ads, formed as an intermediate in the gold deposition reaction.

Original languageEnglish
JournalJournal of the Electrochemical Society
Volume148
Issue number10
DOIs
Publication statusPublished - 2001 Oct

Fingerprint

Thiosulfates
sulfites
Sulfites
Sulfur
Gold
baths
sulfur
inclusions
gold
Gold deposits
deposits
Quartz crystal microbalances
quartz crystals
microbalances
hardness
Hardness
Ligands
Adsorption
ligands
adsorption

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Mechanism of Sulfur Inclusion in Soft Gold Electrodeposited from the Thiosulfate-Sulfite Bath. / Osaka, Tetsuya; Kato, M.; Sato, J.; Yoshizawa, K.; Homma, Takayuki; Okinaka, Y.; Yoshioka, O.

In: Journal of the Electrochemical Society, Vol. 148, No. 10, 10.2001.

Research output: Contribution to journalArticle

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AU - Homma, Takayuki

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AU - Yoshioka, O.

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