TY - GEN
T1 - MEMS LC microchip with low dispersion and low pressure drop turn structure using distribution controlled micro pillar array
AU - Takatsuki, K.
AU - Isokawa, M.
AU - Song, Y.
AU - Nakahara, A.
AU - Yoon, D. H.
AU - Sekiguchi, T.
AU - Mizuno, J.
AU - Funatsu, T.
AU - Tsunoda, M.
AU - Shoji, S.
PY - 2013/4/2
Y1 - 2013/4/2
N2 - MEMS liquid chromatography (LC) microchip with low dispersion and a low pressure drop turn structure was fabricated. In the turn structure, we used higher density pillar array at the inner side while lower density pillar array was used at the outer side to control inner and outer speed of a sample flow. An LC chip with an improved turn structure can obtain similar theoretical plate number (1233) compared to the previously proposed tapered turn (1135). The necessary inlet pressure is also reduced from 2.7 to 0.4 MPa under a flow rate of 10 μL/min. These results show the improved turn structure is applicable for fast analysis time under high flow rate conditions.
AB - MEMS liquid chromatography (LC) microchip with low dispersion and a low pressure drop turn structure was fabricated. In the turn structure, we used higher density pillar array at the inner side while lower density pillar array was used at the outer side to control inner and outer speed of a sample flow. An LC chip with an improved turn structure can obtain similar theoretical plate number (1233) compared to the previously proposed tapered turn (1135). The necessary inlet pressure is also reduced from 2.7 to 0.4 MPa under a flow rate of 10 μL/min. These results show the improved turn structure is applicable for fast analysis time under high flow rate conditions.
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U2 - 10.1109/MEMSYS.2013.6474411
DO - 10.1109/MEMSYS.2013.6474411
M3 - Conference contribution
AN - SCOPUS:84875479644
SN - 9781467356558
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 981
EP - 984
BT - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
T2 - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Y2 - 20 January 2013 through 24 January 2013
ER -