METALLIZATION OF AlN CERAMICS BY ELECTROLESS Ni-P PLATING.

Tetsuya Osaka, Hiroto Nagata, Eiji Nakajima, Ichiro Koiwa, Kazuaki Utsumi

Research output: Contribution to journalArticle

34 Citations (Scopus)

Abstract

Highly thermally conductive aluminum nitride ceramics were metalized by an electroless plated Ni-P film for the purpose of utilizing them in practical electronic circuit substrates. Aluminum nitride substrates were effectively etched by NaOH solution, and the adhesion strength between AIN and the Ni-P film was found to increase with an increase in surface roughness. The authors conclude that substrates of new aluminum nitride of high thermal conductivity are capable of being effectively metalized by electroless plating method, and that the main factor contributing to film adhesion strength is interlocking surface structures that are formed through selective etching by NaOH.

Original languageEnglish
Pages (from-to)2345-2349
Number of pages5
JournalJournal of the Electrochemical Society
Volume133
Issue number11
Publication statusPublished - 1986 Nov

Fingerprint

Aluminum nitride
aluminum nitrides
Bond strength (materials)
adhesion
Substrates
Electroless plating
plating
Surface structure
locking
Etching
Thermal conductivity
surface roughness
thermal conductivity
Surface roughness
etching
ceramics
Networks (circuits)
electronics
aluminum nitride

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Osaka, T., Nagata, H., Nakajima, E., Koiwa, I., & Utsumi, K. (1986). METALLIZATION OF AlN CERAMICS BY ELECTROLESS Ni-P PLATING. Journal of the Electrochemical Society, 133(11), 2345-2349.

METALLIZATION OF AlN CERAMICS BY ELECTROLESS Ni-P PLATING. / Osaka, Tetsuya; Nagata, Hiroto; Nakajima, Eiji; Koiwa, Ichiro; Utsumi, Kazuaki.

In: Journal of the Electrochemical Society, Vol. 133, No. 11, 11.1986, p. 2345-2349.

Research output: Contribution to journalArticle

Osaka, T, Nagata, H, Nakajima, E, Koiwa, I & Utsumi, K 1986, 'METALLIZATION OF AlN CERAMICS BY ELECTROLESS Ni-P PLATING.', Journal of the Electrochemical Society, vol. 133, no. 11, pp. 2345-2349.
Osaka T, Nagata H, Nakajima E, Koiwa I, Utsumi K. METALLIZATION OF AlN CERAMICS BY ELECTROLESS Ni-P PLATING. Journal of the Electrochemical Society. 1986 Nov;133(11):2345-2349.
Osaka, Tetsuya ; Nagata, Hiroto ; Nakajima, Eiji ; Koiwa, Ichiro ; Utsumi, Kazuaki. / METALLIZATION OF AlN CERAMICS BY ELECTROLESS Ni-P PLATING. In: Journal of the Electrochemical Society. 1986 ; Vol. 133, No. 11. pp. 2345-2349.
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