Abstract
Micro-ball bump technology has been developed for flip (FC) interconnections. This technology is based on (1) a production method of fine metal balls (micro-balls) and (2) a gang-bonding method for forming bumps (micro-ball bumps) on chip electrodes. Solder balls of 60-150 mm and gold balls of 35-100 mm in diameter were prepared with extremely uniform diameters and high sphericity. After holding these micro-balls on through-holes of an arrangement plate by a vacuum suction method, the micro-balls were transferred onto the electrodes of the chips in order to form the micro-ball bumps. An excess ball eliminating system and a ball bouncing system were developed for arranging the ball successfully on the plate. The cycle time of the originally developed mounter was 20 seconds for a chip with 300 bumps. Both bumping on a single chip and on multiple chips in a wafer were possible. The micro-solder bumps were formed onto the electrodes covered with under bump metals (UBMs). The micro-solder-balls of 150 mm in diameter were transferred onto the flux printed electrodes of a chip with 220 mm pitch and 45×45 area array. The micro-solder bumps were uniform in composition, volume, and height because of the use of the micro-solder-balls with precisely controlled diameter and composition. Using the micro-gold-balls of 35 mm in diameter, the bumps with 50 mm pitch were formed on Al pads by means of thermocompression bonding. Proposed micro-ball bump technology could be applied to bumping not only for FC interconnections, but also for TABs.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - Electronic Components and Technology Conference |
| Publisher | IEEE |
| Pages | 1472-1476 |
| Number of pages | 5 |
| Publication status | Published - 1998 |
| Externally published | Yes |
| Event | Proceedings of the 1998 48th Electronic Components & Technology Conference - Seattle, WA, USA Duration: 1998 May 25 → 1998 May 28 |
Other
| Other | Proceedings of the 1998 48th Electronic Components & Technology Conference |
|---|---|
| City | Seattle, WA, USA |
| Period | 98/5/25 → 98/5/28 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Micro-ball bump for flip chip interconnections. / Shimokawa, Kenji; Hashino, Eiji; Ohzeki, Yoshio; Tatsumi, Kohei.
Proceedings - Electronic Components and Technology Conference. IEEE, 1998. p. 1472-1476.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Micro-ball bump for flip chip interconnections
AU - Shimokawa, Kenji
AU - Hashino, Eiji
AU - Ohzeki, Yoshio
AU - Tatsumi, Kohei
PY - 1998
Y1 - 1998
N2 - Micro-ball bump technology has been developed for flip (FC) interconnections. This technology is based on (1) a production method of fine metal balls (micro-balls) and (2) a gang-bonding method for forming bumps (micro-ball bumps) on chip electrodes. Solder balls of 60-150 mm and gold balls of 35-100 mm in diameter were prepared with extremely uniform diameters and high sphericity. After holding these micro-balls on through-holes of an arrangement plate by a vacuum suction method, the micro-balls were transferred onto the electrodes of the chips in order to form the micro-ball bumps. An excess ball eliminating system and a ball bouncing system were developed for arranging the ball successfully on the plate. The cycle time of the originally developed mounter was 20 seconds for a chip with 300 bumps. Both bumping on a single chip and on multiple chips in a wafer were possible. The micro-solder bumps were formed onto the electrodes covered with under bump metals (UBMs). The micro-solder-balls of 150 mm in diameter were transferred onto the flux printed electrodes of a chip with 220 mm pitch and 45×45 area array. The micro-solder bumps were uniform in composition, volume, and height because of the use of the micro-solder-balls with precisely controlled diameter and composition. Using the micro-gold-balls of 35 mm in diameter, the bumps with 50 mm pitch were formed on Al pads by means of thermocompression bonding. Proposed micro-ball bump technology could be applied to bumping not only for FC interconnections, but also for TABs.
AB - Micro-ball bump technology has been developed for flip (FC) interconnections. This technology is based on (1) a production method of fine metal balls (micro-balls) and (2) a gang-bonding method for forming bumps (micro-ball bumps) on chip electrodes. Solder balls of 60-150 mm and gold balls of 35-100 mm in diameter were prepared with extremely uniform diameters and high sphericity. After holding these micro-balls on through-holes of an arrangement plate by a vacuum suction method, the micro-balls were transferred onto the electrodes of the chips in order to form the micro-ball bumps. An excess ball eliminating system and a ball bouncing system were developed for arranging the ball successfully on the plate. The cycle time of the originally developed mounter was 20 seconds for a chip with 300 bumps. Both bumping on a single chip and on multiple chips in a wafer were possible. The micro-solder bumps were formed onto the electrodes covered with under bump metals (UBMs). The micro-solder-balls of 150 mm in diameter were transferred onto the flux printed electrodes of a chip with 220 mm pitch and 45×45 area array. The micro-solder bumps were uniform in composition, volume, and height because of the use of the micro-solder-balls with precisely controlled diameter and composition. Using the micro-gold-balls of 35 mm in diameter, the bumps with 50 mm pitch were formed on Al pads by means of thermocompression bonding. Proposed micro-ball bump technology could be applied to bumping not only for FC interconnections, but also for TABs.
UR - http://www.scopus.com/inward/record.url?scp=0031626173&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0031626173&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:0031626173
SP - 1472
EP - 1476
BT - Proceedings - Electronic Components and Technology Conference
PB - IEEE
ER -