Micro-ball bumping technology

Kohei Tatsumi, Yukihiro Yamamoto, Eiji Hashino, Kenji Shimokawa

Research output: Contribution to journalArticlepeer-review


With the latest performance enhancement of mobile facilities typically such as notebook size PCs, mobile telephones, etc., down-sizing and performance enhancement of the semiconductor devices for general use have been accelerated, resulting in demands for semiconductor device assembly in increasingly higher densities. In the high density assembly of high performance semiconductor devices, the bonding wire method using lead frames hitherto widely applied is being substituted with the flip chip method wherein a chip is directly connected to a substrate by forming bumps on the chip. This paper introduces a newly developed bump forming method, the micro-ball bumping technology, and describes advantages of the developed method compared with alternative technologies such as plating and printing methods.

Original languageEnglish
Pages (from-to)46-52
Number of pages7
JournalNippon Steel Technical Report
Issue number84
Publication statusPublished - 2001 Jul 1
Externally publishedYes

ASJC Scopus subject areas

  • Mechanics of Materials
  • Metals and Alloys
  • Materials Chemistry


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