Micro-ball wafer bumping for flip chip interconnection

E. Hashino, K. Shimokawa, Y. Yamamoto, Kohei Tatsumi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Citations (Scopus)

Abstract

A new wafer bumping method using micro-balls was developed that can be used for high-density LSI assembly, specifically for Flip Chip interconnection. Micro solder balls with the diameter ranging from 60 μm to 200 μm were first formed with a high level of accuracy and sphericity. These balls were transferred and bonded to the whole electrode-pads of an 8-inch wafer in one stroke using a fully automated micro ball mounter, which was newly developed. The balls were held on fluxed pads and melted in a reflow furnace. The fluxing was performed using unique stamp system. The productivity and the yield were evaluated under the following conditions. The number of chips on an 8 inch wafer was 616, Pad pitch was 250 μm, Pad number of a chip was 625 (25×25 area array), and the total number of balls on a wafer was 385,000. The yield of forming bumps was confirmed to be higher than 99.995% without repairing and the cycle time of micro ball bumping was ca. 5 min. For an 8 inch wafer. The bump height variation, the bump shear strength and the bond reliability were evaluated in comparison with other methods.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages957-964
Number of pages8
Publication statusPublished - 2001
Externally publishedYes
Event51st Electronic Components and Technology Conference - Orlando, FL, United States
Duration: 2001 May 292001 Jun 1

Other

Other51st Electronic Components and Technology Conference
CountryUnited States
CityOrlando, FL
Period01/5/2901/6/1

Fingerprint

Shear strength
Soldering alloys
Furnaces
Productivity
Electrodes

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Hashino, E., Shimokawa, K., Yamamoto, Y., & Tatsumi, K. (2001). Micro-ball wafer bumping for flip chip interconnection. In Proceedings - Electronic Components and Technology Conference (pp. 957-964)

Micro-ball wafer bumping for flip chip interconnection. / Hashino, E.; Shimokawa, K.; Yamamoto, Y.; Tatsumi, Kohei.

Proceedings - Electronic Components and Technology Conference. 2001. p. 957-964.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hashino, E, Shimokawa, K, Yamamoto, Y & Tatsumi, K 2001, Micro-ball wafer bumping for flip chip interconnection. in Proceedings - Electronic Components and Technology Conference. pp. 957-964, 51st Electronic Components and Technology Conference, Orlando, FL, United States, 01/5/29.
Hashino E, Shimokawa K, Yamamoto Y, Tatsumi K. Micro-ball wafer bumping for flip chip interconnection. In Proceedings - Electronic Components and Technology Conference. 2001. p. 957-964
Hashino, E. ; Shimokawa, K. ; Yamamoto, Y. ; Tatsumi, Kohei. / Micro-ball wafer bumping for flip chip interconnection. Proceedings - Electronic Components and Technology Conference. 2001. pp. 957-964
@inproceedings{1988ab55b2484eb19b3274919b4d38b4,
title = "Micro-ball wafer bumping for flip chip interconnection",
abstract = "A new wafer bumping method using micro-balls was developed that can be used for high-density LSI assembly, specifically for Flip Chip interconnection. Micro solder balls with the diameter ranging from 60 μm to 200 μm were first formed with a high level of accuracy and sphericity. These balls were transferred and bonded to the whole electrode-pads of an 8-inch wafer in one stroke using a fully automated micro ball mounter, which was newly developed. The balls were held on fluxed pads and melted in a reflow furnace. The fluxing was performed using unique stamp system. The productivity and the yield were evaluated under the following conditions. The number of chips on an 8 inch wafer was 616, Pad pitch was 250 μm, Pad number of a chip was 625 (25×25 area array), and the total number of balls on a wafer was 385,000. The yield of forming bumps was confirmed to be higher than 99.995{\%} without repairing and the cycle time of micro ball bumping was ca. 5 min. For an 8 inch wafer. The bump height variation, the bump shear strength and the bond reliability were evaluated in comparison with other methods.",
author = "E. Hashino and K. Shimokawa and Y. Yamamoto and Kohei Tatsumi",
year = "2001",
language = "English",
pages = "957--964",
booktitle = "Proceedings - Electronic Components and Technology Conference",

}

TY - GEN

T1 - Micro-ball wafer bumping for flip chip interconnection

AU - Hashino, E.

AU - Shimokawa, K.

AU - Yamamoto, Y.

AU - Tatsumi, Kohei

PY - 2001

Y1 - 2001

N2 - A new wafer bumping method using micro-balls was developed that can be used for high-density LSI assembly, specifically for Flip Chip interconnection. Micro solder balls with the diameter ranging from 60 μm to 200 μm were first formed with a high level of accuracy and sphericity. These balls were transferred and bonded to the whole electrode-pads of an 8-inch wafer in one stroke using a fully automated micro ball mounter, which was newly developed. The balls were held on fluxed pads and melted in a reflow furnace. The fluxing was performed using unique stamp system. The productivity and the yield were evaluated under the following conditions. The number of chips on an 8 inch wafer was 616, Pad pitch was 250 μm, Pad number of a chip was 625 (25×25 area array), and the total number of balls on a wafer was 385,000. The yield of forming bumps was confirmed to be higher than 99.995% without repairing and the cycle time of micro ball bumping was ca. 5 min. For an 8 inch wafer. The bump height variation, the bump shear strength and the bond reliability were evaluated in comparison with other methods.

AB - A new wafer bumping method using micro-balls was developed that can be used for high-density LSI assembly, specifically for Flip Chip interconnection. Micro solder balls with the diameter ranging from 60 μm to 200 μm were first formed with a high level of accuracy and sphericity. These balls were transferred and bonded to the whole electrode-pads of an 8-inch wafer in one stroke using a fully automated micro ball mounter, which was newly developed. The balls were held on fluxed pads and melted in a reflow furnace. The fluxing was performed using unique stamp system. The productivity and the yield were evaluated under the following conditions. The number of chips on an 8 inch wafer was 616, Pad pitch was 250 μm, Pad number of a chip was 625 (25×25 area array), and the total number of balls on a wafer was 385,000. The yield of forming bumps was confirmed to be higher than 99.995% without repairing and the cycle time of micro ball bumping was ca. 5 min. For an 8 inch wafer. The bump height variation, the bump shear strength and the bond reliability were evaluated in comparison with other methods.

UR - http://www.scopus.com/inward/record.url?scp=0034825922&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0034825922&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0034825922

SP - 957

EP - 964

BT - Proceedings - Electronic Components and Technology Conference

ER -