Micro-cone-shaped Au-bump by gas deposition method for high-density interconnection of LSI chips

Fumito Imura, Hiroshi Nakagawa, Katsuya Kikuchi, Yasuhiro Yamaji, Tokihiko Yokoshima, Masahiro Aoyagi, So Baba, Jun Akedo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The technology of bump connections with high-density and reliability has been developed for 3D packaging of LSI and MEMS devices. A tapered bump has high potential to the bump connections. We focus attention on the formation of the tapered bump with self-forming, simple, and high-throughput process by a photolithography and a gas deposition (GD) method. The thickness photoresist of the holes pattern, which is formed by the photolithography, is used as the mask pattern against the deposition of the Au nanoparticles in the GD method. The deposited Au nanoparticles also horizontally grow so that the shaded mask is gradually formed along edge of the holes pattern, and completely cover in the holes. The micro-cone-shaped Au bump can be automatically formed.

Original languageEnglish
Title of host publication4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008
Pages269-271
Number of pages3
Publication statusPublished - 2008
Externally publishedYes
Event4th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2008 - Munich
Duration: 2008 Apr 212008 Apr 24

Other

Other4th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2008
CityMunich
Period08/4/2108/4/24

Fingerprint

Cones
Gases
Photolithography
Masks
Nanoparticles
Photoresists
MEMS
Packaging
Throughput

Keywords

  • Au bump
  • Bonding
  • Bump connection
  • Cone bump
  • Gas deposition (GD) method
  • Three-dimensional (3D) packaging technology

ASJC Scopus subject areas

  • Hardware and Architecture
  • Ceramics and Composites

Cite this

Imura, F., Nakagawa, H., Kikuchi, K., Yamaji, Y., Yokoshima, T., Aoyagi, M., ... Akedo, J. (2008). Micro-cone-shaped Au-bump by gas deposition method for high-density interconnection of LSI chips. In 4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008 (pp. 269-271)

Micro-cone-shaped Au-bump by gas deposition method for high-density interconnection of LSI chips. / Imura, Fumito; Nakagawa, Hiroshi; Kikuchi, Katsuya; Yamaji, Yasuhiro; Yokoshima, Tokihiko; Aoyagi, Masahiro; Baba, So; Akedo, Jun.

4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008. 2008. p. 269-271.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Imura, F, Nakagawa, H, Kikuchi, K, Yamaji, Y, Yokoshima, T, Aoyagi, M, Baba, S & Akedo, J 2008, Micro-cone-shaped Au-bump by gas deposition method for high-density interconnection of LSI chips. in 4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008. pp. 269-271, 4th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2008, Munich, 08/4/21.
Imura F, Nakagawa H, Kikuchi K, Yamaji Y, Yokoshima T, Aoyagi M et al. Micro-cone-shaped Au-bump by gas deposition method for high-density interconnection of LSI chips. In 4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008. 2008. p. 269-271
Imura, Fumito ; Nakagawa, Hiroshi ; Kikuchi, Katsuya ; Yamaji, Yasuhiro ; Yokoshima, Tokihiko ; Aoyagi, Masahiro ; Baba, So ; Akedo, Jun. / Micro-cone-shaped Au-bump by gas deposition method for high-density interconnection of LSI chips. 4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008. 2008. pp. 269-271
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