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Micro-cone-shaped Au-bump by gas deposition method for high-density interconnection of LSI chips
Fumito Imura, Hiroshi Nakagawa, Katsuya Kikuchi, Yasuhiro Yamaji, Tokihiko Yokoshima, Masahiro Aoyagi, So Baba, Jun Akedo
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2
Citations
(Scopus)