Micro flow devices

Shuichi Shoji, Masayoshi Esashi

Research output: Contribution to conferencePaper

10 Citations (Scopus)

Abstract

Micro flow devices of microvalves, micropumps developed very recently are introduced from the point of view of the actuating principle. Since such micro flow devices have multi-level stack structures of the wafers, the bonding methods play a very important role in the fabrication. The silicon-to-glass and the silicon-to-silicon anodic bonding methods using a sputtered Pyrex glass intermediate layer were studied to realize multi-level stacks. A time-of-flight type flow sensor was fabricated and tested.

Original languageEnglish
Pages89-95
Number of pages7
Publication statusPublished - 1994 Dec 1
EventProceedings of the 1994 5th International Symposium on Micro Machine and Human Science Proceedings - Nagoya, Jpn
Duration: 1994 Oct 21994 Oct 4

Other

OtherProceedings of the 1994 5th International Symposium on Micro Machine and Human Science Proceedings
CityNagoya, Jpn
Period94/10/294/10/4

ASJC Scopus subject areas

  • Mechanical Engineering

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  • Cite this

    Shoji, S., & Esashi, M. (1994). Micro flow devices. 89-95. Paper presented at Proceedings of the 1994 5th International Symposium on Micro Machine and Human Science Proceedings, Nagoya, Jpn, .