Micro flow devices

Shuichi Shoji, Masayoshi Esashi

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    10 Citations (Scopus)

    Abstract

    Micro flow devices of microvalves, micropumps developed very recently are introduced from the point of view of the actuating principle. Since such micro flow devices have multi-level stack structures of the wafers, the bonding methods play a very important role in the fabrication. The silicon-to-glass and the silicon-to-silicon anodic bonding methods using a sputtered Pyrex glass intermediate layer were studied to realize multi-level stacks. A time-of-flight type flow sensor was fabricated and tested.

    Original languageEnglish
    Title of host publicationProceedings of the International Symposium on Micro Machine and Human Science
    Editors Anon
    Place of PublicationPiscataway, NJ, United States
    PublisherIEEE
    Pages89-95
    Number of pages7
    Publication statusPublished - 1994
    EventProceedings of the 1994 5th International Symposium on Micro Machine and Human Science Proceedings - Nagoya, Jpn
    Duration: 1994 Oct 21994 Oct 4

    Other

    OtherProceedings of the 1994 5th International Symposium on Micro Machine and Human Science Proceedings
    CityNagoya, Jpn
    Period94/10/294/10/4

    Fingerprint

    Silicon
    Glass
    Fabrication
    Sensors

    ASJC Scopus subject areas

    • Mechanical Engineering

    Cite this

    Shoji, S., & Esashi, M. (1994). Micro flow devices. In Anon (Ed.), Proceedings of the International Symposium on Micro Machine and Human Science (pp. 89-95). Piscataway, NJ, United States: IEEE.

    Micro flow devices. / Shoji, Shuichi; Esashi, Masayoshi.

    Proceedings of the International Symposium on Micro Machine and Human Science. ed. / Anon. Piscataway, NJ, United States : IEEE, 1994. p. 89-95.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Shoji, S & Esashi, M 1994, Micro flow devices. in Anon (ed.), Proceedings of the International Symposium on Micro Machine and Human Science. IEEE, Piscataway, NJ, United States, pp. 89-95, Proceedings of the 1994 5th International Symposium on Micro Machine and Human Science Proceedings, Nagoya, Jpn, 94/10/2.
    Shoji S, Esashi M. Micro flow devices. In Anon, editor, Proceedings of the International Symposium on Micro Machine and Human Science. Piscataway, NJ, United States: IEEE. 1994. p. 89-95
    Shoji, Shuichi ; Esashi, Masayoshi. / Micro flow devices. Proceedings of the International Symposium on Micro Machine and Human Science. editor / Anon. Piscataway, NJ, United States : IEEE, 1994. pp. 89-95
    @inproceedings{9d510fa1902a4fd1b36dd501d99e7563,
    title = "Micro flow devices",
    abstract = "Micro flow devices of microvalves, micropumps developed very recently are introduced from the point of view of the actuating principle. Since such micro flow devices have multi-level stack structures of the wafers, the bonding methods play a very important role in the fabrication. The silicon-to-glass and the silicon-to-silicon anodic bonding methods using a sputtered Pyrex glass intermediate layer were studied to realize multi-level stacks. A time-of-flight type flow sensor was fabricated and tested.",
    author = "Shuichi Shoji and Masayoshi Esashi",
    year = "1994",
    language = "English",
    pages = "89--95",
    editor = "Anon",
    booktitle = "Proceedings of the International Symposium on Micro Machine and Human Science",
    publisher = "IEEE",

    }

    TY - GEN

    T1 - Micro flow devices

    AU - Shoji, Shuichi

    AU - Esashi, Masayoshi

    PY - 1994

    Y1 - 1994

    N2 - Micro flow devices of microvalves, micropumps developed very recently are introduced from the point of view of the actuating principle. Since such micro flow devices have multi-level stack structures of the wafers, the bonding methods play a very important role in the fabrication. The silicon-to-glass and the silicon-to-silicon anodic bonding methods using a sputtered Pyrex glass intermediate layer were studied to realize multi-level stacks. A time-of-flight type flow sensor was fabricated and tested.

    AB - Micro flow devices of microvalves, micropumps developed very recently are introduced from the point of view of the actuating principle. Since such micro flow devices have multi-level stack structures of the wafers, the bonding methods play a very important role in the fabrication. The silicon-to-glass and the silicon-to-silicon anodic bonding methods using a sputtered Pyrex glass intermediate layer were studied to realize multi-level stacks. A time-of-flight type flow sensor was fabricated and tested.

    UR - http://www.scopus.com/inward/record.url?scp=0028758641&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=0028758641&partnerID=8YFLogxK

    M3 - Conference contribution

    AN - SCOPUS:0028758641

    SP - 89

    EP - 95

    BT - Proceedings of the International Symposium on Micro Machine and Human Science

    A2 - Anon, null

    PB - IEEE

    CY - Piscataway, NJ, United States

    ER -