Microstructure of CoNiFeB electroless-deposited soft magnetic underlayer for perpendicular recording media

Y. K. Takahashi, K. Hono, M. Ishii, S. Itoh, K. Ohashi

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

Abstract

The microstructure of a CoNiFeB film for a soft magnetic underlayer of perpendicular recording media, which was deposited by electroless plating on a Si wafer, has been investigated by transmission electron microscopy and a three-dimensional atom probe. After the deposition of the CoNiFeB film on a Ni underlayer, Hc decreased from about 62 to about 3 Oe. Based on the microstructure observation results, the decrease of Hc was concluded to be the result of reduced magneto-elastic energy. The good adhesiveness between the soft underlayer (SUL) and the Si substrate was found to be due to the composition gradient.

Original languageEnglish
Pages (from-to)490-495
Number of pages6
JournalJournal of Magnetism and Magnetic Materials
Volume320
Issue number3-4
DOIs
Publication statusPublished - 2008 Feb
Externally publishedYes

Keywords

  • 3DAP
  • Microstructure
  • SUL

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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