Miniature integrated capacitive pressure sensor

Yoshinori Matsumoto, Shuichi Shoji, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

A miniature integrated silicon capacitive pressure sensor has been fabricated. The pressure sensor consists of a Pyrex glass and a silicon chip. A silicon diaphragm and a CMOS capacitance to frequency converter are integrated on the same silicon chip. The silicon chip is hermetically sealed by the Pyrex glass using anodic bonding in wafer process. The sensor capacitor is formed by the silicon diaphragm and a counter metal electrode on the Pyrex glass. The output frequency is detected by the current change in power line. The pressure sensor has higher sensitivity, lower temperature drift and lower power consumption than the conventional piezoresistive pressure sensor.

Original languageEnglish
Title of host publicationConference on Solid State Devices and Materials
Editors Anon
Place of PublicationTokyo, Japan
PublisherPubl by Business Cent for Acad Soc Japan
Pages701-704
Number of pages4
Publication statusPublished - 1990
Externally publishedYes
Event22nd International Conference on Solid State Devices and Materials - Sendai, Jpn
Duration: 1990 Aug 221990 Aug 24

Other

Other22nd International Conference on Solid State Devices and Materials
CitySendai, Jpn
Period90/8/2290/8/24

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Matsumoto, Y., Shoji, S., & Esashi, M. (1990). Miniature integrated capacitive pressure sensor. In Anon (Ed.), Conference on Solid State Devices and Materials (pp. 701-704). Publ by Business Cent for Acad Soc Japan.