Mitigation of thermal fatigue failure in fully underfilled lead-free array-based package assemblies using partial underfills

Hong Bin Shi, Toshitsugu Ueda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    7 Citations (Scopus)

    Abstract

    A design of experiments was conducted to determine the thermal cycling reliability of full and partial capillary flow underfilled lead-free chip scale packages (CSPs), the tests were carried out based on the JEDEC JESD22-A104C standard. Two kinds of representative fast cure and reworkable underfill materials are used in this study, and CSPs without underfill were also tested for comparison. The test results show that both two underfill materials reduce the thermal cycling reliability of CSP assemblies. The underfill with high glass transition temperature (Tg) and storage modulus yielded better performance, of course, the CTE is also very critical to the thermomechanical fatigue performance, but its effects is not so obvious in this study due to the similar CTE of used underfills. In addition, the negative effect of partial underfill is smaller than that of full underfill. Failure analysis shows that the dominant failure mode observed is solder cracking near package and/or PCB pads.

    Original languageEnglish
    Title of host publication2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
    Pages542-547
    Number of pages6
    DOIs
    Publication statusPublished - 2011
    Event2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 - Singapore
    Duration: 2011 Dec 72011 Dec 9

    Other

    Other2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
    CitySingapore
    Period11/12/711/12/9

    Fingerprint

    Chip scale packages
    Thermal fatigue
    Lead
    Thermal cycling
    Capillary flow
    Polychlorinated biphenyls
    Soldering alloys
    Design of experiments
    Failure modes
    Failure analysis
    Elastic moduli
    Fatigue of materials

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

    Cite this

    Shi, H. B., & Ueda, T. (2011). Mitigation of thermal fatigue failure in fully underfilled lead-free array-based package assemblies using partial underfills. In 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 (pp. 542-547). [6184480] https://doi.org/10.1109/EPTC.2011.6184480

    Mitigation of thermal fatigue failure in fully underfilled lead-free array-based package assemblies using partial underfills. / Shi, Hong Bin; Ueda, Toshitsugu.

    2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011. 2011. p. 542-547 6184480.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Shi, HB & Ueda, T 2011, Mitigation of thermal fatigue failure in fully underfilled lead-free array-based package assemblies using partial underfills. in 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011., 6184480, pp. 542-547, 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011, Singapore, 11/12/7. https://doi.org/10.1109/EPTC.2011.6184480
    Shi HB, Ueda T. Mitigation of thermal fatigue failure in fully underfilled lead-free array-based package assemblies using partial underfills. In 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011. 2011. p. 542-547. 6184480 https://doi.org/10.1109/EPTC.2011.6184480
    Shi, Hong Bin ; Ueda, Toshitsugu. / Mitigation of thermal fatigue failure in fully underfilled lead-free array-based package assemblies using partial underfills. 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011. 2011. pp. 542-547
    @inproceedings{d802e88945fb40908d0d7cd2c3015449,
    title = "Mitigation of thermal fatigue failure in fully underfilled lead-free array-based package assemblies using partial underfills",
    abstract = "A design of experiments was conducted to determine the thermal cycling reliability of full and partial capillary flow underfilled lead-free chip scale packages (CSPs), the tests were carried out based on the JEDEC JESD22-A104C standard. Two kinds of representative fast cure and reworkable underfill materials are used in this study, and CSPs without underfill were also tested for comparison. The test results show that both two underfill materials reduce the thermal cycling reliability of CSP assemblies. The underfill with high glass transition temperature (Tg) and storage modulus yielded better performance, of course, the CTE is also very critical to the thermomechanical fatigue performance, but its effects is not so obvious in this study due to the similar CTE of used underfills. In addition, the negative effect of partial underfill is smaller than that of full underfill. Failure analysis shows that the dominant failure mode observed is solder cracking near package and/or PCB pads.",
    author = "Shi, {Hong Bin} and Toshitsugu Ueda",
    year = "2011",
    doi = "10.1109/EPTC.2011.6184480",
    language = "English",
    isbn = "9781457719837",
    pages = "542--547",
    booktitle = "2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011",

    }

    TY - GEN

    T1 - Mitigation of thermal fatigue failure in fully underfilled lead-free array-based package assemblies using partial underfills

    AU - Shi, Hong Bin

    AU - Ueda, Toshitsugu

    PY - 2011

    Y1 - 2011

    N2 - A design of experiments was conducted to determine the thermal cycling reliability of full and partial capillary flow underfilled lead-free chip scale packages (CSPs), the tests were carried out based on the JEDEC JESD22-A104C standard. Two kinds of representative fast cure and reworkable underfill materials are used in this study, and CSPs without underfill were also tested for comparison. The test results show that both two underfill materials reduce the thermal cycling reliability of CSP assemblies. The underfill with high glass transition temperature (Tg) and storage modulus yielded better performance, of course, the CTE is also very critical to the thermomechanical fatigue performance, but its effects is not so obvious in this study due to the similar CTE of used underfills. In addition, the negative effect of partial underfill is smaller than that of full underfill. Failure analysis shows that the dominant failure mode observed is solder cracking near package and/or PCB pads.

    AB - A design of experiments was conducted to determine the thermal cycling reliability of full and partial capillary flow underfilled lead-free chip scale packages (CSPs), the tests were carried out based on the JEDEC JESD22-A104C standard. Two kinds of representative fast cure and reworkable underfill materials are used in this study, and CSPs without underfill were also tested for comparison. The test results show that both two underfill materials reduce the thermal cycling reliability of CSP assemblies. The underfill with high glass transition temperature (Tg) and storage modulus yielded better performance, of course, the CTE is also very critical to the thermomechanical fatigue performance, but its effects is not so obvious in this study due to the similar CTE of used underfills. In addition, the negative effect of partial underfill is smaller than that of full underfill. Failure analysis shows that the dominant failure mode observed is solder cracking near package and/or PCB pads.

    UR - http://www.scopus.com/inward/record.url?scp=84860900066&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=84860900066&partnerID=8YFLogxK

    U2 - 10.1109/EPTC.2011.6184480

    DO - 10.1109/EPTC.2011.6184480

    M3 - Conference contribution

    AN - SCOPUS:84860900066

    SN - 9781457719837

    SP - 542

    EP - 547

    BT - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

    ER -