Morphology Control of Cu Added Electrodeposited Bi-Sb-Te Thick Films for Micro-Thermoelectric Devices

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this research, bismuth and tellurium based thermoelectric materials are studied and electrodeposition method was adapted to fabricate the devices. To improve the thermoelectric performance, the thickness of the patterned films was attempted to be increased up to 30 μm. Film properties, such as morphology, composition, resistivity and thermoelectric output, of p-type Cu-added Bi-Sb-Te films were investigated. It was found that the thermoelectric properties were improved with an increase in the film thickness. An annealed buffer layer was created as substrate to control the morphology of Bi-Sb-Te films to be more compact and denser. Finally, 30 μm thick p-type Bi-Sb-Te patterned-films were successfully fabricated, indicating the applicability to micro-thermoelectric devices.

Original languageEnglish
Title of host publicationSelected Proceedings from the 237th ECS Meeting with the 18th International Meeting on Chemical Sensors, IMCS 2020
PublisherIOP Publishing Ltd.
Pages877-883
Number of pages7
Edition7
ISBN (Electronic)9781607688952
DOIs
Publication statusPublished - 2020 Apr 1
Event237th ECS Meeting with the 18th International Meeting on Chemical Sensors, IMCS 2020 - Montreal, Canada
Duration: 2020 May 102020 May 14

Publication series

NameECS Transactions
Number7
Volume97
ISSN (Print)1938-6737
ISSN (Electronic)1938-5862

Conference

Conference237th ECS Meeting with the 18th International Meeting on Chemical Sensors, IMCS 2020
Country/TerritoryCanada
CityMontreal
Period20/5/1020/5/14

ASJC Scopus subject areas

  • Engineering(all)

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