Nano- and micro-filler combination enabling practical use of nanocomposite insulating materials

Takahiro Imai; Gen Komiya; Kiyoko Murayama; Tamon Ozaki; Fumio Sawa; Toshio Shimizu; Miyuki Harada; Mitsukazu Ochi; Yoshimichi Ohki; Toshikatsu Tanaka

doi:10.1109/ISEIM.2008.4664556

Nano- and micro-filler combination enabling practical use of nanocomposite insulating materials

Takahiro Imai^*, Gen Komiya, Kiyoko Murayama, Tamon Ozaki, Fumio Sawa, Toshio Shimizu, Miyuki Harada, Mitsukazu Ochi, Yoshimichi Ohki, Toshikatsu Tanaka

^*Corresponding author for this work

School of Advanced Science and Engineering

Research output: Contribution to conference › Paper › peer-review

8 Citations (Scopus)

Abstract

Recent interests concerning nanocomposites are shifting emphasis from fundamental research to application-oriented research. In this study, nano- and micro-filler mixed composites were made and evaluated toward practical use of nanocomposite insulating materials. Some kinds of the nano-filler/micro-filler combinations such as nano-layered silicate/micro-silica, nano-silica/micro- silica and nano-titania/micro-silica were compared from viewpoints of volume resistivitiy, relative permittivity, thermal expansion and insulation breakdown properties. Comprehensive consideration based on experimental results determined a candidate nano- and micro-filler mixed composites to make trial models. An aluminum conductor and a vacuum interrupter were molded from the nano- and micro-filler mixed composites for the first time in nanocomposite research.

Original language	English
Pages	299-302
Number of pages	4
DOIs	https://doi.org/10.1109/ISEIM.2008.4664556
Publication status	Published - 2008 Dec 31
Event	2008 International Symposium on Electrical Insulating Materials, ISEIM 2008 - Yokkaichi, Japan Duration: 2008 Sept 7 → 2008 Sept 11

Conference

Conference	2008 International Symposium on Electrical Insulating Materials, ISEIM 2008
Country/Territory	Japan
City	Yokkaichi
Period	08/9/7 → 08/9/11

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

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Imai, T., Komiya, G., Murayama, K., Ozaki, T., Sawa, F., Shimizu, T., Harada, M., Ochi, M., Ohki, Y., & Tanaka, T. (2008). Nano- and micro-filler combination enabling practical use of nanocomposite insulating materials. 299-302. Paper presented at 2008 International Symposium on Electrical Insulating Materials, ISEIM 2008, Yokkaichi, Japan. https://doi.org/10.1109/ISEIM.2008.4664556

Imai, T, Komiya, G, Murayama, K, Ozaki, T, Sawa, F, Shimizu, T, Harada, M, Ochi, M, Ohki, Y & Tanaka, T 2008, 'Nano- and micro-filler combination enabling practical use of nanocomposite insulating materials', Paper presented at 2008 International Symposium on Electrical Insulating Materials, ISEIM 2008, Yokkaichi, Japan, 08/9/7 - 08/9/11 pp. 299-302. https://doi.org/10.1109/ISEIM.2008.4664556

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AU - Imai, Takahiro

AU - Komiya, Gen

AU - Murayama, Kiyoko

AU - Ozaki, Tamon

AU - Sawa, Fumio

AU - Shimizu, Toshio

AU - Harada, Miyuki

AU - Ochi, Mitsukazu

AU - Ohki, Yoshimichi

AU - Tanaka, Toshikatsu

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Nano- and micro-filler combination enabling practical use of nanocomposite insulating materials

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ASJC Scopus subject areas

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