Nano- and micro-filler combination enabling practical use of nanocomposite insulating materials

Takahiro Imai, Gen Komiya, Kiyoko Murayama, Tamon Ozaki, Fumio Sawa, Toshio Shimizu, Miyuki Harada, Mitsukazu Ochi, Yoshimichi Ohki, Toshikatsu Tanaka

Research output: Contribution to conferencePaper

8 Citations (Scopus)

Abstract

Recent interests concerning nanocomposites are shifting emphasis from fundamental research to application-oriented research. In this study, nano- and micro-filler mixed composites were made and evaluated toward practical use of nanocomposite insulating materials. Some kinds of the nano-filler/micro-filler combinations such as nano-layered silicate/micro-silica, nano-silica/micro- silica and nano-titania/micro-silica were compared from viewpoints of volume resistivitiy, relative permittivity, thermal expansion and insulation breakdown properties. Comprehensive consideration based on experimental results determined a candidate nano- and micro-filler mixed composites to make trial models. An aluminum conductor and a vacuum interrupter were molded from the nano- and micro-filler mixed composites for the first time in nanocomposite research.

Original languageEnglish
Pages299-302
Number of pages4
DOIs
Publication statusPublished - 2008 Dec 31
Event2008 International Symposium on Electrical Insulating Materials, ISEIM 2008 - Yokkaichi, Japan
Duration: 2008 Sep 72008 Sep 11

Conference

Conference2008 International Symposium on Electrical Insulating Materials, ISEIM 2008
CountryJapan
CityYokkaichi
Period08/9/708/9/11

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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    Imai, T., Komiya, G., Murayama, K., Ozaki, T., Sawa, F., Shimizu, T., Harada, M., Ochi, M., Ohki, Y., & Tanaka, T. (2008). Nano- and micro-filler combination enabling practical use of nanocomposite insulating materials. 299-302. Paper presented at 2008 International Symposium on Electrical Insulating Materials, ISEIM 2008, Yokkaichi, Japan. https://doi.org/10.1109/ISEIM.2008.4664556