Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature

Fengwen Mu, Hui Ren, Lei Liu, Yinghui Wang, Guisheng Zou, Tadatomo Suga

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A low temperature all-Cu bonding via the sintering of nano-Cu paste in Pt-catalyzed formic acid vapor was studied, which was demonstrated with a large tolerance of surface oxidation. The bonding strength of oxidized-Cu to Cu could be significantly improved via the treatment of Pt-catalyzed formic acid vapor. The interfacial analysis was carried out to understand the mechanisms.

Original languageEnglish
Title of host publication2019 International Conference on Electronics Packaging, ICEP 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages365-366
Number of pages2
ISBN (Electronic)9784990218867
DOIs
Publication statusPublished - 2019 Apr 1
Event2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan
Duration: 2019 Apr 172019 Apr 20

Publication series

Name2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference2019 International Conference on Electronics Packaging, ICEP 2019
CountryJapan
CityNiigata
Period19/4/1719/4/20

Fingerprint

formic acid
Formic acid
Ointments
Sintering
Vapors
Adhesive pastes
Oxidation
Temperature

Keywords

  • bonding
  • interface
  • low temperature
  • Nano-Cu paste
  • Pt-catalyzed formic acid
  • sintering

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys

Cite this

Mu, F., Ren, H., Liu, L., Wang, Y., Zou, G., & Suga, T. (2019). Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature. In 2019 International Conference on Electronics Packaging, ICEP 2019 (pp. 365-366). [8733407] (2019 International Conference on Electronics Packaging, ICEP 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2019.8733407

Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature. / Mu, Fengwen; Ren, Hui; Liu, Lei; Wang, Yinghui; Zou, Guisheng; Suga, Tadatomo.

2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 365-366 8733407 (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mu, F, Ren, H, Liu, L, Wang, Y, Zou, G & Suga, T 2019, Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature. in 2019 International Conference on Electronics Packaging, ICEP 2019., 8733407, 2019 International Conference on Electronics Packaging, ICEP 2019, Institute of Electrical and Electronics Engineers Inc., pp. 365-366, 2019 International Conference on Electronics Packaging, ICEP 2019, Niigata, Japan, 19/4/17. https://doi.org/10.23919/ICEP.2019.8733407
Mu F, Ren H, Liu L, Wang Y, Zou G, Suga T. Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature. In 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 365-366. 8733407. (2019 International Conference on Electronics Packaging, ICEP 2019). https://doi.org/10.23919/ICEP.2019.8733407
Mu, Fengwen ; Ren, Hui ; Liu, Lei ; Wang, Yinghui ; Zou, Guisheng ; Suga, Tadatomo. / Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature. 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 365-366 (2019 International Conference on Electronics Packaging, ICEP 2019).
@inproceedings{e2339c9416e64c888b578cb57967a447,
title = "Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature",
abstract = "A low temperature all-Cu bonding via the sintering of nano-Cu paste in Pt-catalyzed formic acid vapor was studied, which was demonstrated with a large tolerance of surface oxidation. The bonding strength of oxidized-Cu to Cu could be significantly improved via the treatment of Pt-catalyzed formic acid vapor. The interfacial analysis was carried out to understand the mechanisms.",
keywords = "bonding, interface, low temperature, Nano-Cu paste, Pt-catalyzed formic acid, sintering",
author = "Fengwen Mu and Hui Ren and Lei Liu and Yinghui Wang and Guisheng Zou and Tadatomo Suga",
year = "2019",
month = "4",
day = "1",
doi = "10.23919/ICEP.2019.8733407",
language = "English",
series = "2019 International Conference on Electronics Packaging, ICEP 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "365--366",
booktitle = "2019 International Conference on Electronics Packaging, ICEP 2019",

}

TY - GEN

T1 - Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature

AU - Mu, Fengwen

AU - Ren, Hui

AU - Liu, Lei

AU - Wang, Yinghui

AU - Zou, Guisheng

AU - Suga, Tadatomo

PY - 2019/4/1

Y1 - 2019/4/1

N2 - A low temperature all-Cu bonding via the sintering of nano-Cu paste in Pt-catalyzed formic acid vapor was studied, which was demonstrated with a large tolerance of surface oxidation. The bonding strength of oxidized-Cu to Cu could be significantly improved via the treatment of Pt-catalyzed formic acid vapor. The interfacial analysis was carried out to understand the mechanisms.

AB - A low temperature all-Cu bonding via the sintering of nano-Cu paste in Pt-catalyzed formic acid vapor was studied, which was demonstrated with a large tolerance of surface oxidation. The bonding strength of oxidized-Cu to Cu could be significantly improved via the treatment of Pt-catalyzed formic acid vapor. The interfacial analysis was carried out to understand the mechanisms.

KW - bonding

KW - interface

KW - low temperature

KW - Nano-Cu paste

KW - Pt-catalyzed formic acid

KW - sintering

UR - http://www.scopus.com/inward/record.url?scp=85068341165&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85068341165&partnerID=8YFLogxK

U2 - 10.23919/ICEP.2019.8733407

DO - 10.23919/ICEP.2019.8733407

M3 - Conference contribution

AN - SCOPUS:85068341165

T3 - 2019 International Conference on Electronics Packaging, ICEP 2019

SP - 365

EP - 366

BT - 2019 International Conference on Electronics Packaging, ICEP 2019

PB - Institute of Electrical and Electronics Engineers Inc.

ER -