Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature

Fengwen Mu, Hui Ren, Lei Liu, Yinghui Wang, Guisheng Zou, Tadatomo Suga

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A low temperature all-Cu bonding via the sintering of nano-Cu paste in Pt-catalyzed formic acid vapor was studied, which was demonstrated with a large tolerance of surface oxidation. The bonding strength of oxidized-Cu to Cu could be significantly improved via the treatment of Pt-catalyzed formic acid vapor. The interfacial analysis was carried out to understand the mechanisms.

Original languageEnglish
Title of host publication2019 International Conference on Electronics Packaging, ICEP 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages365-366
Number of pages2
ISBN (Electronic)9784990218867
DOIs
Publication statusPublished - 2019 Apr 1
Event2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan
Duration: 2019 Apr 172019 Apr 20

Publication series

Name2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference2019 International Conference on Electronics Packaging, ICEP 2019
CountryJapan
CityNiigata
Period19/4/1719/4/20

Keywords

  • bonding
  • interface
  • low temperature
  • Nano-Cu paste
  • Pt-catalyzed formic acid
  • sintering

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys

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  • Cite this

    Mu, F., Ren, H., Liu, L., Wang, Y., Zou, G., & Suga, T. (2019). Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature. In 2019 International Conference on Electronics Packaging, ICEP 2019 (pp. 365-366). [8733407] (2019 International Conference on Electronics Packaging, ICEP 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2019.8733407