Nano-porous structure control under electrodeposition and dealloying conditions for low-temperature bonding

Mikiko Saito, Kaori Matsunaga, Jun Mizuno, Hroshi Nishikawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

We investigated a low-temperature bond formation process, wherein nanoporous structures were formed on electrode surfaces by electrodeposition and dealloying. The morphology control of a nanoporous Au-Ag structure was investigated using electrochemical deposition and electrochemical methods. The ligament size of the electrodeposited Au-Ag films after dealloying increased upon annealing. The ligament size of 10-20 nm for as-deposited increased to 50-100 nm for films annealed at 150 °C. The samples that were annealed at 50 °C before dealloying indicated a finer nanoporous structure, which corresponded to the highest bond strength of the evaluated samples. The volume of selective dissolution was small on as-deposited samples despite the anodic current being the largest of the examined films. Inductively coupled plasma mass spectrometry (ICP-MS) analysis showed that the change of the Ag content of the films after dealloying of as-deposited samples was the smallest of the examined films. Small ligament size with a finer nanoporous structure resulted in high bond strength.

Original languageEnglish
Title of host publicationProceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781479940264
DOIs
Publication statusPublished - 2014 Nov 18
Event5th Electronics System-Integration Technology Conference, ESTC 2014 - Helsinki
Duration: 2014 Sep 162014 Sep 18

Other

Other5th Electronics System-Integration Technology Conference, ESTC 2014
CityHelsinki
Period14/9/1614/9/18

Fingerprint

Electrodeposition
Ligaments
Temperature
Inductively coupled plasma mass spectrometry
Dissolution
Annealing
Electrodes

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Saito, M., Matsunaga, K., Mizuno, J., & Nishikawa, H. (2014). Nano-porous structure control under electrodeposition and dealloying conditions for low-temperature bonding. In Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014 [6962819] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ESTC.2014.6962819

Nano-porous structure control under electrodeposition and dealloying conditions for low-temperature bonding. / Saito, Mikiko; Matsunaga, Kaori; Mizuno, Jun; Nishikawa, Hroshi.

Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. 6962819.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Saito, M, Matsunaga, K, Mizuno, J & Nishikawa, H 2014, Nano-porous structure control under electrodeposition and dealloying conditions for low-temperature bonding. in Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014., 6962819, Institute of Electrical and Electronics Engineers Inc., 5th Electronics System-Integration Technology Conference, ESTC 2014, Helsinki, 14/9/16. https://doi.org/10.1109/ESTC.2014.6962819
Saito M, Matsunaga K, Mizuno J, Nishikawa H. Nano-porous structure control under electrodeposition and dealloying conditions for low-temperature bonding. In Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers Inc. 2014. 6962819 https://doi.org/10.1109/ESTC.2014.6962819
Saito, Mikiko ; Matsunaga, Kaori ; Mizuno, Jun ; Nishikawa, Hroshi. / Nano-porous structure control under electrodeposition and dealloying conditions for low-temperature bonding. Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers Inc., 2014.
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