New formation process of plating thin films on several substrates by means of self-assembled monolayer (SAM) process

Tetsuya Osaka, Masahiro Yoshino

Research output: Contribution to journalArticle

34 Citations (Scopus)

Abstract

This review describes our recent works on the preparation of Ni-alloy films deposited by electroless deposition as a diffusion barrier layer for ultra large-scale integration (ULSI) interconnects by using an all-wet process. In this process, we create a novel wet fabrication process including a self-assembled monolayer (SAM) as an attachment technique between diffusion barrier layer and a substrate. Our proposal process was applied to the substrates of SiO2/Si and both organic (methyl silsesquioxane) and inorganic (hydrogen silsesquioxane) low-k dielectrics. The key technique of this proposed process is using SAM as a catalyst trapping layer. The Ni-alloy films such as NiB were deposited on catalyzed SiO2 or low-k substrates. The electrolessly deposited NiB films were found to exhibit sufficient thermal stability and an acceptable barrier property for preventing Cu diffusion into the SiO2 and low-k dielectrics.

Original languageEnglish
Pages (from-to)271-277
Number of pages7
JournalElectrochimica Acta
Volume53
Issue number2
DOIs
Publication statusPublished - 2007 Dec 1

Fingerprint

Self assembled monolayers
Plating
Diffusion barriers
Thin films
Substrates
ULSI circuits
Electroless plating
Hydrogen
Thermodynamic stability
Fabrication
Catalysts
Low-k dielectric

Keywords

  • Damascene process
  • Diffusion barrier layer
  • Electroless deposition
  • Self-assembled monolayer
  • ULSI

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Analytical Chemistry
  • Electrochemistry

Cite this

New formation process of plating thin films on several substrates by means of self-assembled monolayer (SAM) process. / Osaka, Tetsuya; Yoshino, Masahiro.

In: Electrochimica Acta, Vol. 53, No. 2, 01.12.2007, p. 271-277.

Research output: Contribution to journalArticle

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