New particles technology for oxide-superconductor using dry- and wet-type jet mill

Hirosi Kezuka, Isamu Kato, Tosiki Shirane, Masaaki Ikeda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    Superconducting YBCO particles with an average size of 1-2 μm were prepared by dry-type jet mill. It is found from the measurements of critical currents (Ic) that the superconducting transition temperature (Tc) at 91 - 92 K is obtained for the YBCO particles which have oriented and elongated grains align parallel to (003) (005) and (006) -plane. On the other hand, fine YBCO particles were prepared from high quality superconducting YBCO powders by wet - type jet mill in a high pressure flow of MEK (methyl-ethyl-ketone:CH3COCH2CH3) or toluene(C6H5CH3). As a result, the resulting particles are homogenius in MEK and fine YBCO particles show oriented and polycrystal structures with an average particle size of 164nm in diameter and with the lattice parameter of a=3.9A, b=3.5A in [001]-orientation from TEM (Transmission Electron Microscopy) - studies.

    Original languageEnglish
    Title of host publicationProceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials
    Place of PublicationPiscataway, NJ, United States
    PublisherIEEE
    Pages794-796
    Number of pages3
    Volume2
    Publication statusPublished - 2000
    Event6th Interantional Conference on Properties and Applications of Dielectric Materials - Xi'an, China
    Duration: 2000 Jun 212000 Jun 26

    Other

    Other6th Interantional Conference on Properties and Applications of Dielectric Materials
    CityXi'an, China
    Period00/6/2100/6/26

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    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials

    Cite this

    Kezuka, H., Kato, I., Shirane, T., & Ikeda, M. (2000). New particles technology for oxide-superconductor using dry- and wet-type jet mill. In Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials (Vol. 2, pp. 794-796). IEEE.