New perovskite nanomaterials and their integrations into high-k dielectrics

Minoru Osada, Takayoshi Sasaki

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We report on a bottom-up manufacturing for high-k dielectric films using a novel nanomaterial, namely, a perovskite nanosheet (LaNb2O 7) derived from a layered perovskite by exfoliation. Solution-based layer-by-laver assembly of perovskite nanosheets is effective for room-temperature fabrication of high-k nanocapacitors, which are directly assembled on a SrRuO3 bottom electrode with an atomically sharp interface. These nanocapacitors exhibit high dielectric constants (k > 50) for thichiess down to 5 nm while eliminating problems resulting from the size effect. We also investigate dielectric properties of perovskite nanosheets with different compositions (LaNb2O7, La0.95Eu 0.05Nb2O7 and Eu0.56Ta 2O7) in order to study the influence of A- and B-site modifications on dielectric properties.

Original languageEnglish
Title of host publicationProceedings - 2011 IMAPS/ACerS 7th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2011
Pages72-77
Number of pages6
Publication statusPublished - 2011
Externally publishedYes
Event7th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2011 - San Diego, CA, United States
Duration: 2011 Apr 5 → 2011 Apr 7

Other

Other7th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2011
CountryUnited States
CitySan Diego, CA
Period11/4/5 → 11/4/7

Keywords

  • High-k dielectrics
  • Langmuir-blodgett deposition
  • Layer-by-layer assembly
  • Perovskite nanosheet

ASJC Scopus subject areas

  • Ceramics and Composites
  • Materials Chemistry

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    • Cite this

    Osada, M., & Sasaki, T. (2011). New perovskite nanomaterials and their integrations into high-k dielectrics. In Proceedings - 2011 IMAPS/ACerS 7th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2011 (pp. 72-77)