Newly developed flip-chip bonding technology for high-density interconnects in semiconductor package

Tokihiko Yokoshima, Fumito Imura, Masahiro Aoyagi

Research output: Contribution to journalArticle

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)606-615
Number of pages10
JournalJournal of Japan Institute of Electronics Packaging
Issue number7
Publication statusPublished - 2009 Nov 1

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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