Newly developed flip-chip bonding technology for high-density interconnects in semiconductor package

Tokihiko Yokoshima; Fumito Imura; Masahiro Aoyagi

doi:10.5104/jiep.12.606

Newly developed flip-chip bonding technology for high-density interconnects in semiconductor package

Tokihiko Yokoshima^*, Fumito Imura, Masahiro Aoyagi

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Original language	English
Pages (from-to)	606-615
Number of pages	10
Journal	Journal of Japan Institute of Electronics Packaging
Volume	12
Issue number	7
DOIs	https://doi.org/10.5104/jiep.12.606
Publication status	Published - 2009 Nov
Externally published	Yes

ASJC Scopus subject areas

Electrical and Electronic Engineering

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10.5104/jiep.12.606

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title = "Newly developed flip-chip bonding technology for high-density interconnects in semiconductor package",

author = "Tokihiko Yokoshima and Fumito Imura and Masahiro Aoyagi",

year = "2009",

month = nov,

doi = "10.5104/jiep.12.606",

language = "English",

volume = "12",

pages = "606--615",

journal = "Journal of Japan Institute of Electronics Packaging",

issn = "1343-9677",

publisher = "The Japan Institute of Electronics Packaging",

number = "7",

}

TY - JOUR

T1 - Newly developed flip-chip bonding technology for high-density interconnects in semiconductor package

AU - Yokoshima, Tokihiko

AU - Imura, Fumito

AU - Aoyagi, Masahiro

PY - 2009/11

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DO - 10.5104/jiep.12.606

M3 - Article

AN - SCOPUS:84871230891

SN - 1343-9677

VL - 12

SP - 606

EP - 615

JO - Journal of Japan Institute of Electronics Packaging

JF - Journal of Japan Institute of Electronics Packaging

IS - 7

ER -

Newly developed flip-chip bonding technology for high-density interconnects in semiconductor package

ASJC Scopus subject areas

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