Newly developed flip-chip bonding technology for high-density interconnects in semiconductor package

Tokihiko Yokoshima, Fumito Imura, Masahiro Aoyagi

Research output: Contribution to journalArticle

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)606-615
Number of pages10
JournalJournal of Japan Institute of Electronics Packaging
Volume12
Issue number7
DOIs
Publication statusPublished - 2009 Nov
Externally publishedYes

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Semiconductor materials

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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Newly developed flip-chip bonding technology for high-density interconnects in semiconductor package. / Yokoshima, Tokihiko; Imura, Fumito; Aoyagi, Masahiro.

In: Journal of Japan Institute of Electronics Packaging, Vol. 12, No. 7, 11.2009, p. 606-615.

Research output: Contribution to journalArticle

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