Non-cyanide electroless gold plating using polyphenols as reducing agents

Yutaka Ohtani, Aiko Horiuchi, Aritomo Yamaguchi, Kenichi Oyaizu, Makoto Yuasa

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Polyphenol compounds were investigated as reducing agents for non-cyanide electroless gold plating for electronics assembly applications. The pH value and temperature were optimized to determine the conditions that lead to a high deposition rate without precipitation. The surface morphology was evaluated by scanning electron microscopy. Catechol, pyrogallol, and gallic acid yielded deposited films with good appearance and solderability under the optimized conditions. Among the tested reducing agents, catechol is the most suitable for use as a stable plating bath with a long life. It has a moderate reducing ability to stabilize the bath and deposit the film. The calculated values of the heat of formation and the highest occupied molecular orbital levels of the reducing agents supported the experimental results.

Original languageEnglish
JournalJournal of the Electrochemical Society
Volume153
Issue number1
DOIs
Publication statusPublished - 2006
Externally publishedYes

Fingerprint

Gold plating
Electroless plating
Reducing Agents
Polyphenols
Reducing agents
plating
gold
baths
Pyrogallol
Gallic Acid
heat of formation
Molecular orbitals
Deposition rates
Plating
Surface morphology
molecular orbitals
Electronic equipment
Deposits
assembly
deposits

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Non-cyanide electroless gold plating using polyphenols as reducing agents. / Ohtani, Yutaka; Horiuchi, Aiko; Yamaguchi, Aritomo; Oyaizu, Kenichi; Yuasa, Makoto.

In: Journal of the Electrochemical Society, Vol. 153, No. 1, 2006.

Research output: Contribution to journalArticle

Ohtani, Yutaka ; Horiuchi, Aiko ; Yamaguchi, Aritomo ; Oyaizu, Kenichi ; Yuasa, Makoto. / Non-cyanide electroless gold plating using polyphenols as reducing agents. In: Journal of the Electrochemical Society. 2006 ; Vol. 153, No. 1.
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