Non-destructive diagnosis of degradation of silicone rubber by indenter modulus and scanning probe microscopy

Shugo Hanada, Daisuke Odaka, Liuqing Yang, Naoshi Hirai, Yoshimichi Ohki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

We aged silicone rubber, which is widely used for electrical insulation of cables in nuclear power plants under various conditions. The surface of each sample was measured by an indenter and a scanning probe microscope (SPM) for non-destructive diagnosis. As a result, it has become clear that the surface of silicone rubber becomes hard with the progress of degradation in both cases of thermal aging and simultaneous aging by heat and radiation. The indenter modulus shows a good correlation with the elongation at break (EAB). On the other hand, the delay of phase angle measured by SPM exhibits a rather low correlation with EAB. Through the results of thermal analyses, it seems that the thermal aging without radiation induces cross-linking first, which is followed by bond break. However, bond breakage seems predominant over cross-linking in the simultaneous aging with heat and radiation.

Original languageEnglish
Title of host publicationCMD 2016 - International Conference on Condition Monitoring and Diagnosis
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages123-126
Number of pages4
ISBN (Electronic)9781509033980
DOIs
Publication statusPublished - 2016 Nov 28
Event2016 International Conference on Condition Monitoring and Diagnosis, CMD 2016 - Xi'an, China
Duration: 2016 Sep 252016 Sep 28

Other

Other2016 International Conference on Condition Monitoring and Diagnosis, CMD 2016
CountryChina
CityXi'an
Period16/9/2516/9/28

Fingerprint

Scanning probe microscopy
Silicones
Rubber
Thermal aging
Radiation
Degradation
Elongation
Microscopes
Aging of materials
Scanning
Nuclear power plants
Insulation
Cables
Hot Temperature

Keywords

  • Diagnosis
  • elongation at break
  • indenter modulus
  • nuclear power plant
  • scanning probe microscopy
  • silicone rubber

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

Cite this

Hanada, S., Odaka, D., Yang, L., Hirai, N., & Ohki, Y. (2016). Non-destructive diagnosis of degradation of silicone rubber by indenter modulus and scanning probe microscopy. In CMD 2016 - International Conference on Condition Monitoring and Diagnosis (pp. 123-126). [7757791] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CMD.2016.7757791

Non-destructive diagnosis of degradation of silicone rubber by indenter modulus and scanning probe microscopy. / Hanada, Shugo; Odaka, Daisuke; Yang, Liuqing; Hirai, Naoshi; Ohki, Yoshimichi.

CMD 2016 - International Conference on Condition Monitoring and Diagnosis. Institute of Electrical and Electronics Engineers Inc., 2016. p. 123-126 7757791.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hanada, S, Odaka, D, Yang, L, Hirai, N & Ohki, Y 2016, Non-destructive diagnosis of degradation of silicone rubber by indenter modulus and scanning probe microscopy. in CMD 2016 - International Conference on Condition Monitoring and Diagnosis., 7757791, Institute of Electrical and Electronics Engineers Inc., pp. 123-126, 2016 International Conference on Condition Monitoring and Diagnosis, CMD 2016, Xi'an, China, 16/9/25. https://doi.org/10.1109/CMD.2016.7757791
Hanada S, Odaka D, Yang L, Hirai N, Ohki Y. Non-destructive diagnosis of degradation of silicone rubber by indenter modulus and scanning probe microscopy. In CMD 2016 - International Conference on Condition Monitoring and Diagnosis. Institute of Electrical and Electronics Engineers Inc. 2016. p. 123-126. 7757791 https://doi.org/10.1109/CMD.2016.7757791
Hanada, Shugo ; Odaka, Daisuke ; Yang, Liuqing ; Hirai, Naoshi ; Ohki, Yoshimichi. / Non-destructive diagnosis of degradation of silicone rubber by indenter modulus and scanning probe microscopy. CMD 2016 - International Conference on Condition Monitoring and Diagnosis. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 123-126
@inproceedings{8f2ed3c0f2df4a068ec3ad09d42d38d7,
title = "Non-destructive diagnosis of degradation of silicone rubber by indenter modulus and scanning probe microscopy",
abstract = "We aged silicone rubber, which is widely used for electrical insulation of cables in nuclear power plants under various conditions. The surface of each sample was measured by an indenter and a scanning probe microscope (SPM) for non-destructive diagnosis. As a result, it has become clear that the surface of silicone rubber becomes hard with the progress of degradation in both cases of thermal aging and simultaneous aging by heat and radiation. The indenter modulus shows a good correlation with the elongation at break (EAB). On the other hand, the delay of phase angle measured by SPM exhibits a rather low correlation with EAB. Through the results of thermal analyses, it seems that the thermal aging without radiation induces cross-linking first, which is followed by bond break. However, bond breakage seems predominant over cross-linking in the simultaneous aging with heat and radiation.",
keywords = "Diagnosis, elongation at break, indenter modulus, nuclear power plant, scanning probe microscopy, silicone rubber",
author = "Shugo Hanada and Daisuke Odaka and Liuqing Yang and Naoshi Hirai and Yoshimichi Ohki",
year = "2016",
month = "11",
day = "28",
doi = "10.1109/CMD.2016.7757791",
language = "English",
pages = "123--126",
booktitle = "CMD 2016 - International Conference on Condition Monitoring and Diagnosis",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
address = "United States",

}

TY - GEN

T1 - Non-destructive diagnosis of degradation of silicone rubber by indenter modulus and scanning probe microscopy

AU - Hanada, Shugo

AU - Odaka, Daisuke

AU - Yang, Liuqing

AU - Hirai, Naoshi

AU - Ohki, Yoshimichi

PY - 2016/11/28

Y1 - 2016/11/28

N2 - We aged silicone rubber, which is widely used for electrical insulation of cables in nuclear power plants under various conditions. The surface of each sample was measured by an indenter and a scanning probe microscope (SPM) for non-destructive diagnosis. As a result, it has become clear that the surface of silicone rubber becomes hard with the progress of degradation in both cases of thermal aging and simultaneous aging by heat and radiation. The indenter modulus shows a good correlation with the elongation at break (EAB). On the other hand, the delay of phase angle measured by SPM exhibits a rather low correlation with EAB. Through the results of thermal analyses, it seems that the thermal aging without radiation induces cross-linking first, which is followed by bond break. However, bond breakage seems predominant over cross-linking in the simultaneous aging with heat and radiation.

AB - We aged silicone rubber, which is widely used for electrical insulation of cables in nuclear power plants under various conditions. The surface of each sample was measured by an indenter and a scanning probe microscope (SPM) for non-destructive diagnosis. As a result, it has become clear that the surface of silicone rubber becomes hard with the progress of degradation in both cases of thermal aging and simultaneous aging by heat and radiation. The indenter modulus shows a good correlation with the elongation at break (EAB). On the other hand, the delay of phase angle measured by SPM exhibits a rather low correlation with EAB. Through the results of thermal analyses, it seems that the thermal aging without radiation induces cross-linking first, which is followed by bond break. However, bond breakage seems predominant over cross-linking in the simultaneous aging with heat and radiation.

KW - Diagnosis

KW - elongation at break

KW - indenter modulus

KW - nuclear power plant

KW - scanning probe microscopy

KW - silicone rubber

UR - http://www.scopus.com/inward/record.url?scp=85007271426&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85007271426&partnerID=8YFLogxK

U2 - 10.1109/CMD.2016.7757791

DO - 10.1109/CMD.2016.7757791

M3 - Conference contribution

SP - 123

EP - 126

BT - CMD 2016 - International Conference on Condition Monitoring and Diagnosis

PB - Institute of Electrical and Electronics Engineers Inc.

ER -