Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

Weixin Fu, Jun Mizuno, Shuichi Shoji, Takashi Kasahara, Akiko Okada, Shugo Ishizuka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.

Original languageEnglish
Title of host publicationICSJ 2013 - IEEE CPMT Symposium Japan
PublisherIEEE Computer Society
DOIs
Publication statusPublished - 2013
Event2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto
Duration: 2013 Nov 112013 Nov 13

Other

Other2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
CityKyoto
Period13/11/1113/11/13

Fingerprint

Shear strength
Nanoparticles
Coatings
Substrates

Keywords

  • Ag nanoparticle bump
  • low temperature bonding
  • squeegee-coating method

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Fu, W., Mizuno, J., Shoji, S., Kasahara, T., Okada, A., & Ishizuka, S. (2013). Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating. In ICSJ 2013 - IEEE CPMT Symposium Japan [6756116] IEEE Computer Society. https://doi.org/10.1109/ICSJ.2013.6756116

Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating. / Fu, Weixin; Mizuno, Jun; Shoji, Shuichi; Kasahara, Takashi; Okada, Akiko; Ishizuka, Shugo.

ICSJ 2013 - IEEE CPMT Symposium Japan. IEEE Computer Society, 2013. 6756116.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fu, W, Mizuno, J, Shoji, S, Kasahara, T, Okada, A & Ishizuka, S 2013, Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating. in ICSJ 2013 - IEEE CPMT Symposium Japan., 6756116, IEEE Computer Society, 2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013, Kyoto, 13/11/11. https://doi.org/10.1109/ICSJ.2013.6756116
Fu W, Mizuno J, Shoji S, Kasahara T, Okada A, Ishizuka S. Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating. In ICSJ 2013 - IEEE CPMT Symposium Japan. IEEE Computer Society. 2013. 6756116 https://doi.org/10.1109/ICSJ.2013.6756116
Fu, Weixin ; Mizuno, Jun ; Shoji, Shuichi ; Kasahara, Takashi ; Okada, Akiko ; Ishizuka, Shugo. / Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating. ICSJ 2013 - IEEE CPMT Symposium Japan. IEEE Computer Society, 2013.
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