Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

Weixin Fu, Jun Mizuno, Shuichi Shoji, Takashi Kasahara, Akiko Okada, Shugo Ishizuka

Research output: Contribution to conferencePaper

Abstract

A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.

Original languageEnglish
DOIs
Publication statusPublished - 2013 Jan 1
Event2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto, Japan
Duration: 2013 Nov 112013 Nov 13

Conference

Conference2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
CountryJapan
CityKyoto
Period13/11/1113/11/13

Keywords

  • Ag nanoparticle bump
  • low temperature bonding
  • squeegee-coating method

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Fu, W., Mizuno, J., Shoji, S., Kasahara, T., Okada, A., & Ishizuka, S. (2013). Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating. Paper presented at 2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013, Kyoto, Japan. https://doi.org/10.1109/ICSJ.2013.6756116