Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

Weixin Fu; Jun Mizuno; Shuichi Shoji; Takashi Kasahara; Akiko Okada; Shugo Ishizuka

doi:10.1109/ICSJ.2013.6756116

Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

Weixin Fu, Jun Mizuno, Shuichi Shoji, Takashi Kasahara, Akiko Okada, Shugo Ishizuka

Research output: Contribution to conference › Paper › peer-review

Abstract

A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.

Original language	English
DOIs	https://doi.org/10.1109/ICSJ.2013.6756116
Publication status	Published - 2013 Jan 1
Event	2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto, Japan Duration: 2013 Nov 11 → 2013 Nov 13

Conference

Conference	2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
Country/Territory	Japan
City	Kyoto
Period	13/11/11 → 13/11/13

Keywords

Ag nanoparticle bump
low temperature bonding
squeegee-coating method

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/ICSJ.2013.6756116

Cite this

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title = "Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating",

abstract = "A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.",

keywords = "Ag nanoparticle bump, low temperature bonding, squeegee-coating method",

author = "Weixin Fu and Jun Mizuno and Shuichi Shoji and Takashi Kasahara and Akiko Okada and Shugo Ishizuka",

year = "2013",

month = jan,

day = "1",

doi = "10.1109/ICSJ.2013.6756116",

language = "English",

note = "2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 ; Conference date: 11-11-2013 Through 13-11-2013",

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TY - CONF

T1 - Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

AU - Fu, Weixin

AU - Mizuno, Jun

AU - Shoji, Shuichi

AU - Kasahara, Takashi

AU - Okada, Akiko

AU - Ishizuka, Shugo

PY - 2013/1/1

Y1 - 2013/1/1

N2 - A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.

AB - A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.

KW - Ag nanoparticle bump

KW - low temperature bonding

KW - squeegee-coating method

UR - http://www.scopus.com/inward/record.url?scp=84897521692&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84897521692&partnerID=8YFLogxK

U2 - 10.1109/ICSJ.2013.6756116

DO - 10.1109/ICSJ.2013.6756116

M3 - Paper

AN - SCOPUS:84897521692

T2 - 2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013

Y2 - 11 November 2013 through 13 November 2013

ER -

Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

Abstract

Conference

Keywords

ASJC Scopus subject areas

Access to Document

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