Novel flip-chip bonding technology using chemical process

Yasuhiro Yamaji, Tokihiko Yokoshima, Hirotaka Oosato, Noboru Igawa, Yuichiro Tamura, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

Reductions of bonding temperature and bonding pressure are regarded as key challenges for higher interconnection-density packages in recent years. To avoid negative factors caused by mechanical process such as thermal stress and mechanical damage of the device circuits, we have developed novel flip-chip bonding technology using electroless NiB plating of the chemical process. Bump connection of 2D pattern using electroless NiB plating was realized by controlling extraneous deposition, which is deposited on insulator layer without catalyst. The potential of the novel flip-chip bonding technology using controlled extraneous deposition of the electroless NiB plating was experimentally demonstrated using 20μm-pitch flip-chip test vehicle.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages898-904
Number of pages7
DOIs
Publication statusPublished - 2007
Externally publishedYes
Event57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV
Duration: 2007 May 292007 Jun 1

Other

Other57th Electronic Components and Technology Conference 2007, ECTC '07
CitySparks, NV
Period07/5/2907/6/1

Fingerprint

Electroless plating
Thermal stress
Catalysts
Networks (circuits)
Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Yamaji, Y., Yokoshima, T., Oosato, H., Igawa, N., Tamura, Y., Kikuchi, K., ... Aoyagi, M. (2007). Novel flip-chip bonding technology using chemical process. In Proceedings - Electronic Components and Technology Conference (pp. 898-904). [4249991] https://doi.org/10.1109/ECTC.2007.373905

Novel flip-chip bonding technology using chemical process. / Yamaji, Yasuhiro; Yokoshima, Tokihiko; Oosato, Hirotaka; Igawa, Noboru; Tamura, Yuichiro; Kikuchi, Katsuya; Nakagawa, Hiroshi; Aoyagi, Masahiro.

Proceedings - Electronic Components and Technology Conference. 2007. p. 898-904 4249991.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yamaji, Y, Yokoshima, T, Oosato, H, Igawa, N, Tamura, Y, Kikuchi, K, Nakagawa, H & Aoyagi, M 2007, Novel flip-chip bonding technology using chemical process. in Proceedings - Electronic Components and Technology Conference., 4249991, pp. 898-904, 57th Electronic Components and Technology Conference 2007, ECTC '07, Sparks, NV, 07/5/29. https://doi.org/10.1109/ECTC.2007.373905
Yamaji Y, Yokoshima T, Oosato H, Igawa N, Tamura Y, Kikuchi K et al. Novel flip-chip bonding technology using chemical process. In Proceedings - Electronic Components and Technology Conference. 2007. p. 898-904. 4249991 https://doi.org/10.1109/ECTC.2007.373905
Yamaji, Yasuhiro ; Yokoshima, Tokihiko ; Oosato, Hirotaka ; Igawa, Noboru ; Tamura, Yuichiro ; Kikuchi, Katsuya ; Nakagawa, Hiroshi ; Aoyagi, Masahiro. / Novel flip-chip bonding technology using chemical process. Proceedings - Electronic Components and Technology Conference. 2007. pp. 898-904
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