Novel flip-chip bonding technology using chemical process

Yasuhiro Yamaji, Tokihiko Yokoshima, Hirotaka Oosato, Noboru Igawa, Yuichiro Tamura, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

Reductions of bonding temperature and bonding pressure are regarded as key challenges for higher interconnection-density packages in recent years. To avoid negative factors caused by mechanical process such as thermal stress and mechanical damage of the device circuits, we have developed novel flip-chip bonding technology using electroless NiB plating of the chemical process. Bump connection of 2D pattern using electroless NiB plating was realized by controlling extraneous deposition, which is deposited on insulator layer without catalyst. The potential of the novel flip-chip bonding technology using controlled extraneous deposition of the electroless NiB plating was experimentally demonstrated using 20μm-pitch flip-chip test vehicle.

Original languageEnglish
Title of host publicationProceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
Pages898-904
Number of pages7
DOIs
Publication statusPublished - 2007 Oct 22
Externally publishedYes
Event57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
Duration: 2007 May 292007 Jun 1

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference57th Electronic Components and Technology Conference 2007, ECTC '07
CountryUnited States
CitySparks, NV
Period07/5/2907/6/1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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