Abstract
The novel type of conductive paste has been developed and the application of it has been investigated. In this paper, two types of conductive paste are introduced. One is Polymer thick film type, which should be cured at 150-220 °C. The other is Cermet thick film type, which should be fired at 600 °C or 900 °C. The applications of them are printed circuit pattern, EMI shield, conductive layers for soldering, electrode, hybrid integrated circuit, and so on. On these types of pastes, the specific structure of Ag-Cu alloy powder has an important role for the excellent performances. Ag component is highly concentrated on the surface and its concentration gradually decreases from the surface into the inner part. This unique structure has made it possible to realize an excellent durability (especially oxidation resistance), sufficient adhesion strength, and least ionmigration comparable to existing Cu paste. In addition, the distribution of the powder size is suitable for the conductive paste. In using as the PTF paste, high electroconductivity comparable to Ag has been obtained. And in using as the CTF paste, the excellent sintering property at comparatively low temperature has been exhibited. In this paper, at first, the unique characteristics of Ag-Cu powder will be shown and some examples of application will be described.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium |
| Publisher | IEEE |
| Pages | 337-341 |
| Number of pages | 5 |
| Publication status | Published - 1997 |
| Externally published | Yes |
| Event | Proceedings of the 1997 IEEE/CPMT 20th International Electronic Manufacturing Symposium - Tokyo, Jpn Duration: 1997 Apr 16 → 1997 Apr 18 |
Other
| Other | Proceedings of the 1997 IEEE/CPMT 20th International Electronic Manufacturing Symposium |
|---|---|
| City | Tokyo, Jpn |
| Period | 97/4/16 → 97/4/18 |
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ASJC Scopus subject areas
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering
Cite this
Novel type of conductive paste using functionally gradient Ag-Cu powder. / Hori, T.; Otani, A.; Ogura, Y.; Nakamura, M.; Matsuda, H.; Sato, J.
Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium. IEEE, 1997. p. 337-341.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Novel type of conductive paste using functionally gradient Ag-Cu powder
AU - Hori, T.
AU - Otani, A.
AU - Ogura, Y.
AU - Nakamura, M.
AU - Matsuda, H.
AU - Sato, J.
PY - 1997
Y1 - 1997
N2 - The novel type of conductive paste has been developed and the application of it has been investigated. In this paper, two types of conductive paste are introduced. One is Polymer thick film type, which should be cured at 150-220 °C. The other is Cermet thick film type, which should be fired at 600 °C or 900 °C. The applications of them are printed circuit pattern, EMI shield, conductive layers for soldering, electrode, hybrid integrated circuit, and so on. On these types of pastes, the specific structure of Ag-Cu alloy powder has an important role for the excellent performances. Ag component is highly concentrated on the surface and its concentration gradually decreases from the surface into the inner part. This unique structure has made it possible to realize an excellent durability (especially oxidation resistance), sufficient adhesion strength, and least ionmigration comparable to existing Cu paste. In addition, the distribution of the powder size is suitable for the conductive paste. In using as the PTF paste, high electroconductivity comparable to Ag has been obtained. And in using as the CTF paste, the excellent sintering property at comparatively low temperature has been exhibited. In this paper, at first, the unique characteristics of Ag-Cu powder will be shown and some examples of application will be described.
AB - The novel type of conductive paste has been developed and the application of it has been investigated. In this paper, two types of conductive paste are introduced. One is Polymer thick film type, which should be cured at 150-220 °C. The other is Cermet thick film type, which should be fired at 600 °C or 900 °C. The applications of them are printed circuit pattern, EMI shield, conductive layers for soldering, electrode, hybrid integrated circuit, and so on. On these types of pastes, the specific structure of Ag-Cu alloy powder has an important role for the excellent performances. Ag component is highly concentrated on the surface and its concentration gradually decreases from the surface into the inner part. This unique structure has made it possible to realize an excellent durability (especially oxidation resistance), sufficient adhesion strength, and least ionmigration comparable to existing Cu paste. In addition, the distribution of the powder size is suitable for the conductive paste. In using as the PTF paste, high electroconductivity comparable to Ag has been obtained. And in using as the CTF paste, the excellent sintering property at comparatively low temperature has been exhibited. In this paper, at first, the unique characteristics of Ag-Cu powder will be shown and some examples of application will be described.
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UR - http://www.scopus.com/inward/citedby.url?scp=0030689573&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:0030689573
SP - 337
EP - 341
BT - Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium
PB - IEEE
ER -