Novel type of conductive paste using functionally gradient Ag-Cu powder

T. Hori; A. Otani; Y. Ogura; M. Nakamura; H. Matsuda; J. Sato

Novel type of conductive paste using functionally gradient Ag-Cu powder

T. Hori, A. Otani, Y. Ogura, M. Nakamura, H. Matsuda, J. Sato

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The novel type of conductive paste has been developed and the application of it has been investigated. In this paper, two types of conductive paste are introduced. One is Polymer thick film type, which should be cured at 150-220 °C. The other is Cermet thick film type, which should be fired at 600 °C or 900 °C. The applications of them are printed circuit pattern, EMI shield, conductive layers for soldering, electrode, hybrid integrated circuit, and so on. On these types of pastes, the specific structure of Ag-Cu alloy powder has an important role for the excellent performances. Ag component is highly concentrated on the surface and its concentration gradually decreases from the surface into the inner part. This unique structure has made it possible to realize an excellent durability (especially oxidation resistance), sufficient adhesion strength, and least ionmigration comparable to existing Cu paste. In addition, the distribution of the powder size is suitable for the conductive paste. In using as the PTF paste, high electroconductivity comparable to Ag has been obtained. And in using as the CTF paste, the excellent sintering property at comparatively low temperature has been exhibited. In this paper, at first, the unique characteristics of Ag-Cu powder will be shown and some examples of application will be described.

Original language	English
Title of host publication	Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium
Publisher	IEEE
Pages	337-341
Number of pages	5
Publication status	Published - 1997
Externally published	Yes
Event	Proceedings of the 1997 IEEE/CPMT 20th International Electronic Manufacturing Symposium - Tokyo, Jpn Duration: 1997 Apr 16 → 1997 Apr 18

Other

Other	Proceedings of the 1997 IEEE/CPMT 20th International Electronic Manufacturing Symposium
City	Tokyo, Jpn
Period	97/4/16 → 97/4/18

ASJC Scopus subject areas

Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Novel type of conductive paste using functionally gradient Ag-Cu powder'. Together they form a unique fingerprint.

Cite this

Hori, T, Otani, A, Ogura, Y, Nakamura, M, Matsuda, H & Sato, J 1997, Novel type of conductive paste using functionally gradient Ag-Cu powder. in Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium. IEEE, pp. 337-341, Proceedings of the 1997 IEEE/CPMT 20th International Electronic Manufacturing Symposium, Tokyo, Jpn, 97/4/16.

@inproceedings{1d4d332bd0fd42229df5bb00df972bf3,

title = "Novel type of conductive paste using functionally gradient Ag-Cu powder",

abstract = "The novel type of conductive paste has been developed and the application of it has been investigated. In this paper, two types of conductive paste are introduced. One is Polymer thick film type, which should be cured at 150-220 °C. The other is Cermet thick film type, which should be fired at 600 °C or 900 °C. The applications of them are printed circuit pattern, EMI shield, conductive layers for soldering, electrode, hybrid integrated circuit, and so on. On these types of pastes, the specific structure of Ag-Cu alloy powder has an important role for the excellent performances. Ag component is highly concentrated on the surface and its concentration gradually decreases from the surface into the inner part. This unique structure has made it possible to realize an excellent durability (especially oxidation resistance), sufficient adhesion strength, and least ionmigration comparable to existing Cu paste. In addition, the distribution of the powder size is suitable for the conductive paste. In using as the PTF paste, high electroconductivity comparable to Ag has been obtained. And in using as the CTF paste, the excellent sintering property at comparatively low temperature has been exhibited. In this paper, at first, the unique characteristics of Ag-Cu powder will be shown and some examples of application will be described.",

author = "T. Hori and A. Otani and Y. Ogura and M. Nakamura and H. Matsuda and J. Sato",

year = "1997",

language = "English",

pages = "337--341",

booktitle = "Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium",

publisher = "IEEE",

note = "Proceedings of the 1997 IEEE/CPMT 20th International Electronic Manufacturing Symposium ; Conference date: 16-04-1997 Through 18-04-1997",

}

TY - GEN

T1 - Novel type of conductive paste using functionally gradient Ag-Cu powder

AU - Hori, T.

AU - Otani, A.

AU - Ogura, Y.

AU - Nakamura, M.

AU - Matsuda, H.

AU - Sato, J.

PY - 1997

Y1 - 1997

N2 - The novel type of conductive paste has been developed and the application of it has been investigated. In this paper, two types of conductive paste are introduced. One is Polymer thick film type, which should be cured at 150-220 °C. The other is Cermet thick film type, which should be fired at 600 °C or 900 °C. The applications of them are printed circuit pattern, EMI shield, conductive layers for soldering, electrode, hybrid integrated circuit, and so on. On these types of pastes, the specific structure of Ag-Cu alloy powder has an important role for the excellent performances. Ag component is highly concentrated on the surface and its concentration gradually decreases from the surface into the inner part. This unique structure has made it possible to realize an excellent durability (especially oxidation resistance), sufficient adhesion strength, and least ionmigration comparable to existing Cu paste. In addition, the distribution of the powder size is suitable for the conductive paste. In using as the PTF paste, high electroconductivity comparable to Ag has been obtained. And in using as the CTF paste, the excellent sintering property at comparatively low temperature has been exhibited. In this paper, at first, the unique characteristics of Ag-Cu powder will be shown and some examples of application will be described.

AB - The novel type of conductive paste has been developed and the application of it has been investigated. In this paper, two types of conductive paste are introduced. One is Polymer thick film type, which should be cured at 150-220 °C. The other is Cermet thick film type, which should be fired at 600 °C or 900 °C. The applications of them are printed circuit pattern, EMI shield, conductive layers for soldering, electrode, hybrid integrated circuit, and so on. On these types of pastes, the specific structure of Ag-Cu alloy powder has an important role for the excellent performances. Ag component is highly concentrated on the surface and its concentration gradually decreases from the surface into the inner part. This unique structure has made it possible to realize an excellent durability (especially oxidation resistance), sufficient adhesion strength, and least ionmigration comparable to existing Cu paste. In addition, the distribution of the powder size is suitable for the conductive paste. In using as the PTF paste, high electroconductivity comparable to Ag has been obtained. And in using as the CTF paste, the excellent sintering property at comparatively low temperature has been exhibited. In this paper, at first, the unique characteristics of Ag-Cu powder will be shown and some examples of application will be described.

UR - http://www.scopus.com/inward/record.url?scp=0030689573&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0030689573&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0030689573

SP - 337

EP - 341

BT - Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

PB - IEEE

T2 - Proceedings of the 1997 IEEE/CPMT 20th International Electronic Manufacturing Symposium

Y2 - 16 April 1997 through 18 April 1997

ER -