Nucleation and growth of Cu adsorbates on hydrogen-terminated Si(111) surface in solution

Ken Ichi Hara*, Takashi Tanii, Iwao Ohdomari

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Abstract

We report, for the first time, the behavior of Cu nucleation and growth on hydrogen- (H-) terminated Si(111) surface in solution. The samples were prepared by immersing H-terminated Si(111) surfaces in Cu-containing sulfuric acid solution with various immersion times. The Cu-adsorbed silicon surfaces were observed with an atomic force microscope (AFM). Statistical analysis of the AFM images indicates that Cu nucleation occurred immediately after immersing into the solution, and the coverage of the surfaces with Cu adsorbates increased linearly with immersion time although the average height increased negligibly. These results suggest that the growth behavior of Cu adsorbate on H-terminatcd Si(111) surfaces is fundamentally two-dimensional due to the long-range migration of Cu ions which were reduced at the silicon/solution interface.

Original languageEnglish
Pages (from-to)6860-6863
Number of pages4
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume38
Issue number12 A
DOIs
Publication statusPublished - 1999 Dec 1

Keywords

  • 2D growth
  • AFM
  • Cu-deposition
  • H-terminated Si(111)
  • Wet process

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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