Numerical Investigation of Metal Insulation Technique on Turn-to-Turn Contact Resistance of REBCO Pancake Coils

So Noguchi, Ryosuke Miyao, Katsutoshi Monma, Hajime Igarashi, Atsushi Ishiyama

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

Abstract

No-insulation (NI) REBCO pancake coils show high thermal stability, however the charging delay is an issue. Hence, to improve the charging delay, it was proposed that a stainless steel (SUS) tape was cowound between turns, called 'metal-as-insulation' or 'metal-insulation (MI),' to increase the turn-to-turn contact resistivity. The MI technique could make the turn-to-turn contact resistivity approximately 50 times large compared to a conventional NI REBCO pancake coil. This paper reports a bypass current behavior on the cross section of MI REBCO pancake coil using two-dimensional finite element method. The influence of the SUS tape thickness, the MI material, and the number of SUS tapes on the turn-to-turn contact resistivity is investigated. As the result, it is clarified that the turn-to-turn contact resistivity strongly depends on the surface condition and number of SUS tapes.

Original languageEnglish
Article number7817744
JournalIEEE Transactions on Applied Superconductivity
Volume27
Issue number4
DOIs
Publication statusPublished - 2017 Jun

Keywords

  • Metal insulation
  • NI RENCO pancake coil
  • stainless steel co-winding
  • turn-to-turn contact surface

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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