Numerical Investigation of Metal Insulation Technique on Turn-to-Turn Contact Resistance of REBCO Pancake Coils

So Noguchi, Ryosuke Miyao, Katsutoshi Monma, Hajime Igarashi, Atsushi Ishiyama

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    5 Citations (Scopus)

    Abstract

    No-insulation (NI) REBCO pancake coils show high thermal stability, however the charging delay is an issue. Hence, to improve the charging delay, it was proposed that a stainless steel (SUS) tape was cowound between turns, called 'metal-as-insulation' or 'metal-insulation (MI),' to increase the turn-to-turn contact resistivity. The MI technique could make the turn-to-turn contact resistivity approximately 50 times large compared to a conventional NI REBCO pancake coil. This paper reports a bypass current behavior on the cross section of MI REBCO pancake coil using two-dimensional finite element method. The influence of the SUS tape thickness, the MI material, and the number of SUS tapes on the turn-to-turn contact resistivity is investigated. As the result, it is clarified that the turn-to-turn contact resistivity strongly depends on the surface condition and number of SUS tapes.

    Original languageEnglish
    Article number7817744
    JournalIEEE Transactions on Applied Superconductivity
    Volume27
    Issue number4
    DOIs
    Publication statusPublished - 2017 Jun 1

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    Keywords

    • Metal insulation
    • NI RENCO pancake coil
    • stainless steel co-winding
    • turn-to-turn contact surface

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Electrical and Electronic Engineering

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