Numerical prediction of fraction of eutectic phase in Sn-Ag-Cu soldering using the phase-field method

Machiko Ode, Minoru Ueshima, Taichi Abe, Hideyuki Murakami, Hidehiro Onodera

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1 Citation (Scopus)


A combination of macroscale solidification simulation and phase-field calculation is employed to predict the volume fraction of the eutectic phase in Sn-4.0 mass%Ag-XCu solder alloys (X = 0.5-1.1 mass%). The solidification simulation incorporates the cooling rate in the phase-field simulation. We assume the residual liquid solidifies as eutectic phase when the driving force for the nucleation of Cu 6Sn 5 amounts to a critical value, which is determined based on the experimental data. Though the calculation results depend on the experimental data, the obtained fractions are about 40% for 0.5 mass%Cu and more than 90% for 1.1 mass%Cu alloy, which shows good agreement with the experimental data.

Original languageEnglish
Pages (from-to)1969-1974
Number of pages6
JournalJournal of Electronic Materials
Issue number11
Publication statusPublished - 2006 Nov 1



  • Fraction of eutectic phase
  • Lead-free solder
  • Phase-field model
  • Sn-Ag-Cu

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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