Numerical prediction of fraction of eutectic phase in Sn-Ag-Cu soldering using the phase-field method

Machiko Ode, Minoru Ueshima, Taichi Abe, Hideyuki Murakami, Hidehiro Onodera

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

A combination of macroscale solidification simulation and phase-field calculation is employed to predict the volume fraction of the eutectic phase in Sn-4.0 mass%Ag-XCu solder alloys (X = 0.5-1.1 mass%). The solidification simulation incorporates the cooling rate in the phase-field simulation. We assume the residual liquid solidifies as eutectic phase when the driving force for the nucleation of Cu 6Sn 5 amounts to a critical value, which is determined based on the experimental data. Though the calculation results depend on the experimental data, the obtained fractions are about 40% for 0.5 mass%Cu and more than 90% for 1.1 mass%Cu alloy, which shows good agreement with the experimental data.

Original languageEnglish
Pages (from-to)1969-1974
Number of pages6
JournalJournal of Electronic Materials
Volume35
Issue number11
DOIs
Publication statusPublished - 2006 Nov 1
Externally publishedYes

Fingerprint

soldering
Soldering
eutectics
Eutectics
Solidification
predictions
Soldering alloys
solidification
Volume fraction
Nucleation
Cooling
simulation
Liquids
solders
nucleation
cooling
liquids

Keywords

  • Fraction of eutectic phase
  • Lead-free solder
  • Phase-field model
  • Sn-Ag-Cu

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Materials Science(all)
  • Physics and Astronomy (miscellaneous)

Cite this

Numerical prediction of fraction of eutectic phase in Sn-Ag-Cu soldering using the phase-field method. / Ode, Machiko; Ueshima, Minoru; Abe, Taichi; Murakami, Hideyuki; Onodera, Hidehiro.

In: Journal of Electronic Materials, Vol. 35, No. 11, 01.11.2006, p. 1969-1974.

Research output: Contribution to journalArticle

Ode, Machiko ; Ueshima, Minoru ; Abe, Taichi ; Murakami, Hideyuki ; Onodera, Hidehiro. / Numerical prediction of fraction of eutectic phase in Sn-Ag-Cu soldering using the phase-field method. In: Journal of Electronic Materials. 2006 ; Vol. 35, No. 11. pp. 1969-1974.
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