Numerical prediction of fraction of eutectic phase in Sn-Ag-Cu soldering using the phase-field method

A combination of macroscale solidification simulation and phase-field calculation is employed to predict the volume fraction of the eutectic phase in Sn-4.0 mass%Ag-XCu solder alloys (X = 0.5-1.1 mass%). The solidification simulation incorporates the cooling rate in the phase-field simulation. We assume the residual liquid solidifies as eutectic phase when the driving force for the nucleation of Cu ₆Sn ₅ amounts to a critical value, which is determined based on the experimental data. Though the calculation results depend on the experimental data, the obtained fractions are about 40% for 0.5 mass%Cu and more than 90% for 1.1 mass%Cu alloy, which shows good agreement with the experimental data.