On-chip optical interconnect

Keishi Ohashi*, Kenichi Nishi, Takanori Shimizu, Masafumi Nakada, Junichi Fujikata, Jun Ushida, Sunao Toru, Koichi Nose, Masayuki Mizuno, Hiroaki Yukawa, Masao Kinoshita, Nobuo Suzuki, Akiko Gomyo, Tsutomu Ishi, Daisuke Okamoto, Katsuya Furue, Toshihide Ueno, Tai Tsuchizawa, Toshifumi Watanabe, Koji YamadaSei Ichi Itabashi, Jun Akedo

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

101 Citations (Scopus)


We describe a cost-effective and low-powerconsumption approach for on-chip optical interconnection. This approach includes an investigation into architectures, devices, and materials. We have proposed and fabricated a bonded structure of an si-based optical layer on a large-scale integration (LSI) chip. The fabricated optical layer contains Si nanophotodiodes for optical detectors, which are coupled with SiON waveguides using surface-plasmon antennas. Optical signals were introduced to the optical layer and distributed to the Si nanophotodiodes. The output signals from the photodiodes were sent electrically to the transimpedance-amplifier circuitries in the LSI. The signals from the photodiodes triggered of the circuitries at 5 GHz. since electrooptical modulators consume the most power in on-chip optical interconnect systems and require a large footprint, they are critical to establish on-chip optical interconnection. Two approaches are investigated: l) an architecture using a fewer number of modulators and 2) high electrooptical coefficient materials.

Original languageEnglish
Article number5075754
Pages (from-to)1186-1196
Number of pages11
JournalProceedings of the IEEE
Issue number7
Publication statusPublished - 2009 Jul
Externally publishedYes


  • Clocks
  • Lanthanum-modified lead zirconium titanate (plzt) ceramics
  • Optical interconnections
  • Photodiodes

ASJC Scopus subject areas

  • Computer Science(all)
  • Electrical and Electronic Engineering


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