Abstract
3-D IC can significantly alleviate the interconnect problem coming with the decreasing feature size and increasing integrated density. In this work, we concentrate on the 3-D IC floorplanning. It is proved that the number of configuration of 3-D floorplans is less than that of planar floorplans. Sequence Pair is extended (P-SP) to represent 3-D IC floorplans. A new solution perturbation method Remove and Insertion (RI) is implemented based on the technique of enumerating insertion points in P-SP, which is used in the traditional simulated annealing algorithm. The experimental results demonstrate the efficiency and the effectiveness of the proposed method.
Original language | English |
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Title of host publication | IEEE Asia-Pacific Conference on Circuits and Systems, Proceedings, APCCAS |
Pages | 1867-1870 |
Number of pages | 4 |
DOIs | |
Publication status | Published - 2006 |
Event | APCCAS 2006 - 2006 IEEE Asia Pacific Conference on Circuits and Systems - Duration: 2006 Dec 4 → 2006 Dec 6 |
Other
Other | APCCAS 2006 - 2006 IEEE Asia Pacific Conference on Circuits and Systems |
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Period | 06/12/4 → 06/12/6 |
Keywords
- 3-D
- Floorplanning
- Sequence pair
- VLSI
ASJC Scopus subject areas
- Engineering(all)